IC,FLIP-FLOP,DUAL,D TYPE,AS-TTL,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| DM74AS74J/A+ | DM74AS74J | DM74AS74M/A+ | DM74AS74M/B+ | |
|---|---|---|---|---|
| Description | IC,FLIP-FLOP,DUAL,D TYPE,AS-TTL,DIP,14PIN,CERAMIC | IC,FLIP-FLOP,DUAL,D TYPE,AS-TTL,DIP,14PIN,CERAMIC | IC,FLIP-FLOP,DUAL,D TYPE,AS-TTL,SOP,14PIN,PLASTIC | IC,FLIP-FLOP,DUAL,D TYPE,AS-TTL,SOP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| Reach Compliance Code | unknow | compliant | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) |