DM74L187AJ/A+ datasheet, PDF - EEWORLD Datasheet

DM74L187AJ/A+: DescriptionIC,ROM,256X4,TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size201KB，3 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM74L187AJ/A+ Overview

IC,ROM,256X4,TTL,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknow
ECCN code	EAR99
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
memory density	1024 bi
Memory IC Type	MASK ROM
memory width	4
Number of terminals	16
word count	256 words
character code	256
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum slew rate	0.025 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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