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DM87SR183N/B+

Description
IC,PROM,1KX8,TTL,DIP,24PIN,PLASTIC
Categorystorage    storage   
File Size275KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric

DM87SR183N/B+ Overview

IC,PROM,1KX8,TTL,DIP,24PIN,PLASTIC

DM87SR183N/B+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP24,.3
Reach Compliance Codeunknow
ECCN codeEAR99
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density8192 bi
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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