
256KX8 STANDARD SRAM, 85ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | TSOP1 |
| package instruction | TSOP1, TSSOP32,.56,20 |
| Contacts | 32 |
| Reach Compliance Code | unknow |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 85 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e6 |
| length | 11.8 mm |
| memory density | 2097152 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Encapsulate equivalent code | TSSOP32,.56,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Minimum standby current | 1 V |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 2.2 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | TIN BISMUTH |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8 mm |

| UPD442000AGU-DD85X-9JH-A | UPD442000AGU-BC10X-9KH-A | UPD442000AGU-DD10X-9JH-A | UPD442000AGU-BC10X-9JH-A | UPD442000AGU-BC85X-9KH-A | UPD442000AGU-DD85X-9KH-A | UPD442000AGU-BB85X-9KH-A | UPD442000AGU-BB55X-9KH-A | |
|---|---|---|---|---|---|---|---|---|
| Description | 256KX8 STANDARD SRAM, 85ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 100ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 100ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 100ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 85ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 85ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 85ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 | 256KX8 STANDARD SRAM, 55ns, PDSO32, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
| package instruction | TSOP1, TSSOP32,.56,20 | TSSOP, | TSOP1, TSSOP32,.56,20 | TSOP1, TSSOP32,.56,20 | TSOP1-R, TSSOP32,.56,20 | TSSOP, | TSSOP, | TSSOP, |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 85 ns | 100 ns | 100 ns | 100 ns | 85 ns | 85 ns | 85 ns | 55 ns |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e6 | e3/e6 | e6 | e6 | e6 | e3/e6 | e3/e6 | e3/e6 |
| length | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm |
| memory density | 2097152 bi | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | TSSOP | TSOP1 | TSOP1 | TSOP1-R | TSSOP | TSSOP | TSSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| Maximum supply voltage (Vsup) | 2.2 V | 3.6 V | 2.2 V | 3.6 V | 3.6 V | 2.2 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 1.8 V | 2.2 V | 1.8 V | 2.2 V | 2.2 V | 1.8 V | 2.7 V | 2.7 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | OTHER | OTHER | OTHER |
| Terminal surface | TIN BISMUTH | MATTE TIN/TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | MATTE TIN/TIN BISMUTH | MATTE TIN/TIN BISMUTH | MATTE TIN/TIN BISMUTH |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Nominal supply voltage (Vsup) | 2 V | 3 V | 2 V | - | - | 3 V | 3 V | 3 V |