SML-D12W8W (A)
lFeatures
•
Original device technology enables high brightness and high reliability
• Low 2mA operating current.
lOutline
Datasheet
lSize
1006 (0402)
1608 (0603)
1.6×0.8mm (t=0.55mm)
1.0×0.6mm (t=0.2mm)
lDimensions
Color
Type
W
lRecommended
Solder Pattern
Tolerance :
0.1
(unit : mm)
(unit : mm)
lSpecifications
Part No.
Chip
Structure
Emitting
Color
Absolute Maximum Ratings (Ta=25ºC)
Peak Forward
Reverse
Operating Temp.
Storage Temp.
Dissipation
Current
Current
Voltage
P
D
(mW)
I
F
(mA) I
FP
(mA) V
R
(V)
Topr(ºC)
Tstg(ºC)
Power
Forward
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag V
F
Reverse Current I
R
Typ.
(V)
I
F
(mA)
Max.
(mA)
V
R
(V)
Dominant Wavelength
lD
Luminous Intensity I
V
2
I
F
Min. Typ.
Min.* Typ.
Max.*
2
I
F
(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
SML-D12W8W (A)
AIGaInP
Yellow
on GaAs
52
20
100*
1
12
-40
to
+100
-40
to
+100
2.0
2
10
12
-
587.5
-
2
4.5
7.1
2
*1
: Duty 1/10, 1kHz
*2
: Reference
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
1/6
2013.11 - Rev.A
SML-D12W8W (A)
lElectrical
Characteristics Curves
Data Sheet
Fig.1 Forward Current - Forward Voltages
SML-D12W8W (A)
Ta=25ºC
RELATIVE LUMINOUS INTENSITY [a.u.]
100
1.6
1.4
1.2
1
0.8
0.6
Fig.2 Luminous Intensity -
Atmosphere Temperature
I
F
=2mA
FORWARD CURRENT : I
F
[mA]
10
0.4
SML-D12W8W (A)
1
1.4
1.6
1.8
2.0
2.2
2.4
0.2
-40
-20
0
20
40
60
80
100
FORWARD VOLTAGE : V
F
[V]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
SML-D12W8W (A)
Fig.4 Derating
MAXIMUM FORWARD CURRENT : [mA]
30
SML-D12W8W (A)
RELATIVE LUMINOUS INTENSITY [a.u.]
10
Ta=25ºC
8
6
20
4
10
2
0
0
5
10
15
20
0
-40
-20
0
20
40
60
80
100
FORWARD CURRENT : I
F
[mA]
AMBIENT TEMPERATURE : Ta [ºC]
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
2/6
2013.11 - Rev.A
SML-D12W8W (A)
lTaping
2
4
±0.1
＋0.1
0
Data Sheet
±0.1
1.9
±0.1
3.5
±0.05
1.75
±0.05
φ1.5
0.2
±
0.05
0½0.5
1
-0.07
+0.1
5.5
8.0
0.73
+0.1
-0.07
11.4
±1
+1
0
Packing quantity
3000pcs/reel
Pull
direction
φ13
φ180
φ60
0
-3
(unit : mm)
（Unit：mm)
(Note) Tolerance is
0.2mm,
unless otherwise specified.
(note)
Tolerance is within
±0.2mm
unless otherwise specified
lPart
No. Construction
lPacking
Specification
ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card
inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
4/6
2013.11 - Rev.A
SML-D12W8W (A)
lAttention
Points In Handling
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
0.8mm
Data Sheet
(Fig-1)
0.8mm
0.85mm
0.8mm
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
Thorough design review is recommended before the final designing
This product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape.
PCB Bonding Direction
2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
Max.260ºC, Within 10sec
140 to 180ºC
230 to 260ºC
Min.1 min Max. 40sec
(Fig-2)
3.HANDLING AFTER MOUNTING (Fig-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee
the falling of the device by outside force after mounting.
Outside Force
Emitting Direction
Mold
Substrate
Soldering part
PCB
(Fig-3)
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© 2013 ROHM Co., Ltd. All rights reserved.
5/6
2013.11 - Rev.A
Microcontroller MCU
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