K7N161801A-FI25 datasheet, PDF

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K7N161801A-FI25: DescriptionZBT SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165; Categorystorage storage; File Size622KB，28 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7N161801A-FI25 Overview

ZBT SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

K7N161801A-FI25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compli
ECCN code	3A991.B.2.A
Maximum access time	2.6 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	250 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	18874368 bi
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.06 A
Minimum standby current	3.14 V
Maximum slew rate	0.47 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm

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K7N163601A

K7N163201A

K7N161801A

Document Title

512Kx36/32 & 1Mx18 Pipelined NtRAM

512Kx36/32 & 1Mx18-Bit Pipelined NtRAM

Revision History

Rev. No.

0.0

0.1

0.2

0.3

History

1. Initial document.

1. Add JTAG Scan Order

1. Add x32 org and industrial temperature .

2. Add 165FBGA package

1. Speed bin merge.

From K7N1636(32/18)09A to K7N1636(32/18)01A.

2. AC parameter change.

tOH(min)/tLZC(min) from 0.8 to 1.5 at -25

tOH(min)/tLZC(min) from 1.0 to 1.5 at -22

tOH(min)/tLZC(min) from 1.0 to 1.5 at -20

Final spec release.

Release Icc on page 14.

part #

-25

-22

-20

-16

-13

From

440

400

370

340

280

470

430

400

350

290

Draft Date

Remark

March. 21. 2001 Preliminary

May. 10. 2001 Preliminary

Aug. 30. 2001 Preliminary

Dec.

26. 2001 Preliminary

1.0

2.0

May. 10 .2002

May. 22. 2002

Final

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

-1-

May 2002

Rev 2.0

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