K8S6615ETD-FC7E0 datasheet, PDF

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K8S6615ETD-FC7E0: DescriptionFlash, 4MX16, 70ns, PBGA44, 7.50 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44; Categorystorage storage; File Size1MB，48 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8S6615ETD-FC7E0 Overview

Flash, 4MX16, 70ns, PBGA44, 7.50 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44

K8S6615ETD-FC7E0 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	44
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	70 ns
Other features	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup block	TOP
JESD-30 code	R-PBGA-B44
memory density	67108864 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	44
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM

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Rev. 1.2, Sep. 2010

K8S6815ET(B)D

64Mb D-die SLC NOR FLASH

7.5x5, 44FBGA, 8M Partition, x16, Muxed Burst, 8Banks

1.7V ~ 1.95V

datasheet

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed

herein is provided on an "AS IS" basis, without warranties of any kind.

This document and all information discussed herein remain the sole and exclusive property of Samsung

Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property

right is granted by one party to the other party under this document, by implication, estoppel or other-

wise.

Samsung products are not intended for use in life support, critical care, medical, safety equipment, or

similar applications where product failure could result in loss of life or personal or physical harm, or any

military or defense application, or any governmental procurement to which special terms or provisions

may apply.

For updates or additional information about Samsung products, contact your nearest Samsung office.

All brand names, trademarks and registered trademarks belong to their respective owners.

ⓒ

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K8S6815ET(B)D

datasheet

Rev. 1.2

NOR FLASH MEMORY

Table Of Contents

64Mb D-die SLC NOR FLASH

1.0 FEATURES................................................................................................................................................................. 4

2.0 GENERAL DESCRIPTION ......................................................................................................................................... 4

3.0 PIN DESCRIPTION .................................................................................................................................................... 5

4.0 PIN CONFIGURATION ............................................................................................................................................... 5

5.0 FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................. 6

6.0 ORDERING INFORMATION ...................................................................................................................................... 6

7.0 PRODUCT INTRODUCTION...................................................................................................................................... 8

8.0 COMMAND DEFINITIONS ......................................................................................................................................... 9

9.0 DEVICE OPERATION ................................................................................................................................................ 11

9.1 Read Mode .............................................................................................................................................................. 11

9.1.1 Asynchronous Read Mode................................................................................................................................ 11

9.1.2 Synchronous (Burst) Read Mode...................................................................................................................... 11

9.2 Programmable Wait State ....................................................................................................................................... 12

9.3 Handshaking............................................................................................................................................................ 12

9.4 Set Burst Mode Configuration Register ................................................................................................................... 13

9.4.1 Extended Configuration Register (option : K8S6615ET(B)D only).................................................................... 13

9.4.2 Programmable Wait State Configuration........................................................................................................... 13

9.4.3 Burst Read Mode Setting .................................................................................................................................. 13

9.4.4 RDY Configuration ............................................................................................................................................ 13

9.5 Autoselect Mode...................................................................................................................................................... 14

9.6 Standby Mode ......................................................................................................................................................... 14

9.7 Automatic Sleep Mode ............................................................................................................................................ 14

9.8 Output Disable Mode ............................................................................................................................................... 14

9.9 Block Protection & Unprotection.............................................................................................................................. 14

9.10 Hardware Reset..................................................................................................................................................... 15

9.11 Software Reset ...................................................................................................................................................... 15

9.12 Program ................................................................................................................................................................. 15

9.13 Accelerated Program Operation ............................................................................................................................ 15

9.14 Unlock Bypass....................................................................................................................................................... 16

9.15 Chip Erase ............................................................................................................................................................. 16

9.16 Block Erase ........................................................................................................................................................... 16

9.17 Erase Suspend / Resume...................................................................................................................................... 16

9.18 Program Suspend / Resume ................................................................................................................................. 17

9.19 Read While Write Operation .................................................................................................................................. 17

9.20 OTP Block Region ................................................................................................................................................. 17

9.21 Low VCC Write Inhibit ........................................................................................................................................... 17

9.22 Logical Inhibit......................................................................................................................................................... 17

9.23 Power-up Protection .............................................................................................................................................. 17

10.0 FLASH MEMORY STATUS FLAGS ......................................................................................................................... 18

11.0 COMMON FLASH MEMORY INTERFACE .............................................................................................................. 20

12.0 ABSOLUTE MAXI010MUM RATINGS ..................................................................................................................... 22

13.0 RECOMMENDED OPERATING CONDITIONS (Voltage reference to GND)........................................................... 22

14.0 DC CHARACTERISTICS .......................................................................................................................................... 22

15.0 CAPACITANCE (TA = 25 °C, VCC = 1.8V, f = 1.0MHz)........................................................................................... 24

16.0 AC TEST CONDITION.............................................................................................................................................. 24

17.0 AC CHARACTERISTICS .......................................................................................................................................... 25

17.1 Synchronous/Burst Read....................................................................................................................................... 25

17.2 Asynchronous Read .............................................................................................................................................. 29

17.3 Hardware Reset(RESET) ...................................................................................................................................... 31

17.4 Erase/Program Operation...................................................................................................................................... 32

17.5 FLASH Erase/Program Performance .................................................................................................................... 32

18.0 CROSSING OF FIRST WORD BOUNDARY IN BURST READ MODE ................................................................... 39

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