K9F1208Q0A-DCB0 datasheet, PDF

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K9F1208Q0A-DCB0: DescriptionFlash, 64MX8, 30ns, PBGA63, TBGA-63; Categorystorage storage; File Size796KB，44 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K9F1208Q0A-DCB0 Overview

Flash, 64MX8, 30ns, PBGA63, TBGA-63

K9F1208Q0A-DCB0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA, BGA63,10X12,32
Contacts	63
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	30 ns
Other features	CONTAINS ADDITIONAL 16M BIT NAND FLASH
command user interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B63
JESD-609 code	e0
length	11 mm
memory density	536870912 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	4K
Number of terminals	63
word count	67108864 words
character code	64000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64MX8
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA63,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	512 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8 V
Programming voltage	1.8 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1 mm
Department size	16K
Maximum standby current	0.00005 A
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
width	9 mm

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K9F1208Q0A-DCB0,DIB0

K9F1208U0A-YCB0,YIB0

K9F1208U0A-DCB0,DIB0

K9F1216Q0A-DCB0,DIB0

K9F1216U0A-YCB0,YIB0

K9F1216U0A-DCB0,DIB0

K9F1208U0A-VCB0,VIB0

Preliminary

FLASH MEMORY

Document Title

64M x 8 Bit , 32M x 16 Bit NAND Flash Memory

Revision History

Revision No. History

0.0

0.1

Initial issue.

TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.

(before) 9 x 11 /0.8mm pitch , Width 1.0 mm

(after ) To Be Decided.

TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.

(before) 9 x 11 /0.8mm pitch , Width 1.0 mm, to

(after) 8.5 x 15 /0.8mm pitch, Width 1.0mm

Draft Date

Apr. 25th 2002

May. 9th 2002

Remark

Preliminary

0.2

July, 10th 2002

Note : For more detailed features and specifications including FAQ, please refer to Samsung’ Flash web site.

http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html

The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right

to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have

any questions, please contact the SAMSUNG branch office near you.

K9F1208Q0A-DCB0 Related Products

	K9F1208Q0A-DCB0	K9F1208U0A-YIB0	K9F1208U0A-VCB0	K9F1208U0A-VIB0	K9F1208U0A-YCB0	K9F1208Q0A-DIB0	K9F1216U0A-YCB0	K9F1216U0A-YIB0	K9F1216Q0A-DIB0
Description	Flash, 64MX8, 30ns, PBGA63, TBGA-63	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PDSO48, 12 X 17 MM, 0.7 MM HEIGHT, PLASTIC, WSOP1-48	Flash, 64MX8, 30ns, PDSO48, 12 X 17 MM, 0.7 MM HEIGHT, PLASTIC, WSOP1-48	Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	Flash, 64MX8, 30ns, PBGA63, TBGA-63	Flash, 32MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	Flash, 32MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	Flash, 32MX16, 30ns, PBGA63, TBGA-63
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	TSOP1	SOIC	SOIC	TSOP1	BGA	TSOP1	TSOP1	BGA
package instruction	VFBGA, BGA63,10X12,32	TSOP1, TSSOP48,.8,20	VSSOP, TSSOP48,.71,20	VSSOP, TSSOP48,.71,20	TSOP1, TSSOP48,.8,20	VFBGA, BGA63,10X12,32	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP48,.8,20	VFBGA,
Contacts	63	48	48	48	48	63	48	48	63
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant	compliant	compliant	unknow
ECCN code	EAR99	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
Other features	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH	CONTAINS ADDITIONAL 16M BIT NAND FLASH
JESD-30 code	R-PBGA-B63	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PBGA-B63	R-PDSO-G48	R-PDSO-G48	R-PBGA-B63
length	11 mm	18.4 mm	15.4 mm	15.4 mm	18.4 mm	11 mm	18.4 mm	18.4 mm	11 mm
memory density	536870912 bi	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	63	48	48	48	48	63	48	48	63
word count	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	67108864 words	33554432 words	33554432 words	33554432 words
character code	64000000	64000000	64000000	64000000	64000000	64000000	32000000	32000000	32000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-	-40 °C	-	-40 °C	-	-40 °C	-40 °C
organize	64MX8	64MX8	64MX8	64MX8	64MX8	64MX8	32MX16	32MX16	32MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	TSOP1	VSSOP	VSSOP	TSOP1	VFBGA	TSOP1	TSOP1	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	1.8 V	2.7 V	2.7 V	2.7 V	2.7 V	1.8 V	2.7 V	2.7 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1.2 mm	0.7 mm	0.7 mm	1.2 mm	1 mm	1.2 mm	1.2 mm	1 mm
Maximum supply voltage (Vsup)	1.95 V	3.6 V	3.6 V	3.6 V	3.6 V	1.95 V	3.6 V	3.6 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	2.7 V	2.7 V	2.7 V	2.7 V	1.65 V	2.7 V	2.7 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	3.3 V	3.3 V	3.3 V	3.3 V	1.8 V	3.3 V	3.3 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
width	9 mm	12 mm	12 mm	12 mm	12 mm	9 mm	12 mm	12 mm	9 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-
command user interface	YES	YES	YES	YES	YES	YES	YES	YES	-
Data polling	NO	NO	NO	NO	NO	NO	NO	NO	-
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	-
Number of departments/size	4K	4K	4K	4K	4K	4K	4K	4K	-
Encapsulate equivalent code	BGA63,10X12,32	TSSOP48,.8,20	TSSOP48,.71,20	TSSOP48,.71,20	TSSOP48,.8,20	BGA63,10X12,32	TSSOP48,.8,20	TSSOP48,.8,20	-
page size	512 words	512 words	512 words	512 words	512 words	512 words	256 words	256 words	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	1.8 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	1.8 V	3/3.3 V	3/3.3 V	-
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES	-
Department size	16K	16K	16K	16K	16K	16K	8K	8K	-
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	-
Maximum slew rate	0.015 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.015 mA	0.02 mA	0.02 mA	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
switch bit	NO	NO	NO	NO	NO	NO	NO	NO	-

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