SMJ626162-12HKD datasheet, PDF

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SMJ626162-12HKD: Description1MX16 SYNCHRONOUS DRAM, 8ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50; Categorystorage storage; File Size629KB，42 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SMJ626162-12HKD Overview

1MX16 SYNCHRONOUS DRAM, 8ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50

SMJ626162-12HKD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DFP
package instruction	DFP, FL50,.67,32
Contacts	50
Reach Compliance Code	_compli
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	8 ns
Other features	AUTO REFRESH
Maximum clock frequency (fCLK)	83 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-CDFP-F50
length	21 mm
memory density	16777216 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	50
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX16
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL50,.67,32
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Filter level	38535Q/M;38534H;883B
Maximum seat height	3.55 mm
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.18 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.5 mm

SMJ626162-12HKD Related Products

	SMJ626162-12HKD	SMJ626162-20HKDM	SMJ626162-15HKD	SMJ626162-15HKDM	SMJ626162-12HKDM
Description	1MX16 SYNCHRONOUS DRAM, 8ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50	1MX16 SYNCHRONOUS DRAM, 10ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50	1MX16 SYNCHRONOUS DRAM, 9ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50	1MX16 SYNCHRONOUS DRAM, 9ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50	1MX16 SYNCHRONOUS DRAM, 8ns, CDFP50, 0.650 INCH, CERAMIC, DFP-50
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DFP	DFP	DFP	DFP	DFP
package instruction	DFP, FL50,.67,32	DFP,	DFP, FL50,.67,32	DFP,	DFP,
Contacts	50	50	50	50	50
Reach Compliance Code	_compli	unknown	not_compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	8 ns	10 ns	9 ns	9 ns	8 ns
Other features	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH
JESD-30 code	R-CDFP-F50	R-CDFP-F50	R-CDFP-F50	R-CDFP-F50	R-CDFP-F50
length	21 mm	21 mm	21 mm	21 mm	21 mm
memory density	16777216 bi	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	16	16	16	16	16
Number of functions	1	1	1	1	1
Number of ports	1	1	1	1	1
Number of terminals	50	50	50	50	50
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	DFP	DFP	DFP	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.55 mm	3.55 mm	3.55 mm	3.55 mm	3.55 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	16.5 mm	16.5 mm	16.5 mm	16.5 mm	16.5 mm
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-
refresh cycle	4096	4096	4096	4096	-

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