IC IC,LOGIC GATE,HEX 2-INPUT NAND,ALS-TTL,DIP,20PIN,PLASTIC, Gate
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | _compli |
| JESD-30 code | R-PDIP-T20 |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.024 A |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum supply current (ICC) | 12 mA |
| Prop。Delay @ Nom-Su | 8 ns |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| SN74ALS1804AN3 | SN74AS1804N3 | SN74AS1804NP3 | SN74ALS1804ANP3 | SN74ALS1804ADW3 | SN74ALS1804ADWP3 | |
|---|---|---|---|---|---|---|
| Description | IC IC,LOGIC GATE,HEX 2-INPUT NAND,ALS-TTL,DIP,20PIN,PLASTIC, Gate | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,PLASTIC | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,PLASTIC | IC,LOGIC GATE,HEX 2-INPUT NAND,ALS-TTL,DIP,20PIN,PLASTIC | IC IC,LOGIC GATE,HEX 2-INPUT NAND,ALS-TTL,SOP,20PIN,PLASTIC, Gate | IC IC,LOGIC GATE,HEX 2-INPUT NAND,ALS-TTL,SOP,20PIN,PLASTIC, Gate |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| JESD-30 code | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.024 A | 0.048 A | 0.048 A | 0.024 A | 0.024 A | 0.024 A |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Maximum supply current (ICC) | 12 mA | 27 mA | 27 mA | 12 mA | 12 mA | 12 mA |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| surface mount | NO | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Texas Instruments | - | - | Texas Instruments | Texas Instruments | Texas Instruments |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Prop。Delay @ Nom-Sup | - | 4 ns | 4 ns | 8 ns | 8 ns | - |