EEWORLDEEWORLDEEWORLD

Part Number

Search

3640KC132KA11A

Description
Ceramic Capacitor, Multilayer, Ceramic, 5000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0013uF, Surface Mount, 3640, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size70KB,2 Pages
ManufacturerAVX
Environmental Compliance  
Download Datasheet Parametric View All

3640KC132KA11A Overview

Ceramic Capacitor, Multilayer, Ceramic, 5000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0013uF, Surface Mount, 3640, CHIP, ROHS COMPLIANT

3640KC132KA11A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAVX
package instruction, 3640
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.0013 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee4
Manufacturer's serial number3640
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)5000 V
size code3640
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceSilver/Palladium (Ag/Pd)
Terminal shapeWRAPAROUND
High Voltage MLC Chips
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/dc blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
4000V =
5000V =
C
A
S
G
W
H
J
K
A
271
K
A
1
1
A
Temperature Capacitance Code Capacitance
Test Level
Termination*
Coefficient
(2 significant digits
Tolerance
A = Standard 1 = Pd/Ag
C0G = A
+ no. of zeros)
C0G:J = ±5%
T = Plated
X7R = C
Examples:
K = ±10%
Ni and Sn
(RoHS Compliant)
10 pF = 100
M = ±20%
100 pF = 101 X7R:K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
*Note:
Terminations with 5% minimum lead (Pb) is available, see pages 84 and 85 for LD style.
Leaded terminations are available, see pages 88 and 89.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
millimeters (inches)
0805
1206
1210*
1808*
1812*
1825*
2220*
2225*
3640*
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
1.70
2.03
2.54
2.54
3.30
2.54
2.54
Max.
(0.051)
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
(t) terminal min. 0.50 ± 0.25
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
*Reflow Soldering Only
82
[[HC32F460 development board review] (Part 2) Review of three low-power modes of the HC32F460 microcontroller
[i=s]This post was last edited by Mengxi Kaiwu on 2021-5-10 13:14[/i]1. IntroductionThe main features of the HC32F460 series products state: CPU dynamic power consumption is 80μA/MHz, and power consum...
梦溪开物 Domestic Chip Exchange
TI's Sitara AM3352 processor with up to 1 GHz and rich peripheral resources
With the increasing number of terminal devices and the growing demand for large-scale data exchange, data concentrators will face new requirements and challenges in terms of performance and interfaces...
Aguilera Microcontroller MCU
Ren Zhiqiang said he would no longer recruit Tsinghua graduates because they were "unretainable"
Ren Zhiqiang, chairman of Huayuan Real Estate, often makes shocking remarks and is known as "Ren the Big Cannon". Two days ago , Ren the Big Cannon made another statement when he attended a forum held...
张无忌1987 Talking about work
MSP430F5529 Study Notes 2-ADC12
Development version model: SEED—MSP430F5529A Development tool: CCS 5.4v The following are some simple demos of ADC12 operation in CCS, which are organized as follows: For information about MSP430F5529...
qinkaiabc Microcontroller MCU
DAC
How to write a program for 12-bit digital-to-analog conversion, DAC7811...
真菌拉拖鞋 MCU
How to use C language to develop dsp embedded system!
DSP is compatible with C and assembly programming. The simplicity of C and the high execution speed of assembly are a perfect combination. Let's talk about C and DSP first! [[i] This post was last edi...
gaoxiao Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 619  1738  2365  176  2564  13  35  48  4  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号