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EP1K30FC256-3

Description
LOADABLE PLD, 0.6 ns, PBGA256
CategoryProgrammable logic devices    Programmable logic   
File Size512KB,86 Pages
ManufacturerAltera (Intel)
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EP1K30FC256-3 Overview

LOADABLE PLD, 0.6 ns, PBGA256

EP1K30FC256-3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAltera (Intel)
Parts packaging codeBGA
package instructionFINE LINE, BGA-256
Contacts256
Reach Compliance Code_compli
ECCN codeEAR99
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Humidity sensitivity level3
Number of I/O lines171
Number of entries171
Number of logical units1728
Output times171
Number of terminals256
Maximum operating temperature70 °C
Minimum operating temperature
organize171 I/O
Output functionMIXED
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)220
power supply2.5,2.5/3.3 V
Programmable logic typeLOADABLE PLD
propagation delay0.6 ns
Certification statusNot Qualified
Maximum seat height2.1 mm
Maximum supply voltage2.625 V
Minimum supply voltage2.375 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
ACEX 1K
®
Programmable Logic Device Family
Data Sheet
May 2003, ver. 3.4
Features...
Programmable logic devices (PLDs), providing low cost
system-on-a-programmable-chip (SOPC) integration in a single
device
Enhanced embedded array for implementing megafunctions
such as efficient memory and specialized logic functions
Dual-port capability with up to 16-bit width per embedded array
block (EAB)
Logic array for general logic functions
High density
10,000 to 100,000 typical gates (see
Table 1)
Up to 49,152 RAM bits (4,096 bits per EAB, all of which can be
used without reducing logic capacity)
Cost-efficient programmable architecture for high-volume
applications
Cost-optimized process
Low cost solution for high-performance communications
applications
System-level features
MultiVolt
TM
I/O pins can drive or be driven by 2.5-V, 3.3-V, or
5.0-V devices
Low power consumption
Bidirectional I/O performance (setup time [t
SU
] and clock-to-
output delay [t
CO
]) up to 250 MHz
Fully compliant with the peripheral component interconnect
Special Interest Group (PCI SIG)
PCI Local Bus Specification,
Revision 2.2
for 3.3-V operation at 33 MHz or 66 MHz
Extended temperature range
13
Tools
Table 1. ACEX
TM
1K Device Features
Feature
Typical gates
Maximum system gates
Logic elements (LEs)
EABs
Total RAM bits
Maximum user I/O pins
EP1K10
10,000
56,000
576
3
12,288
136
EP1K30
30,000
119,000
1,728
6
24,576
171
EP1K50
50,000
199,000
2,880
10
40,960
249
EP1K100
100,000
257,000
4,992
12
49,152
333
Altera Corporation
DS-ACEX-3.4
1

EP1K30FC256-3 Related Products

EP1K30FC256-3 EP1K100QC208-3
Description LOADABLE PLD, 0.6 ns, PBGA256 LOADABLE PLD, 0.7 ns, PQFP208
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Altera (Intel) Altera (Intel)
Parts packaging code BGA QFP
package instruction FINE LINE, BGA-256 PLASTIC, QFP-208
Contacts 256 208
Reach Compliance Code _compli unknow
ECCN code EAR99 3A991
JESD-30 code S-PBGA-B256 S-PQFP-G208
JESD-609 code e0 e0
length 17 mm 28 mm
Humidity sensitivity level 3 3
Number of I/O lines 171 147
Number of entries 171 147
Number of logical units 1728 4992
Output times 171 147
Number of terminals 256 208
Maximum operating temperature 70 °C 70 °C
organize 171 I/O 147 I/O
Output function MIXED MIXED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA FQFP
Encapsulate equivalent code BGA256,16X16,50 QFP208,1.2SQ,20
Package shape SQUARE SQUARE
Package form GRID ARRAY FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) 220 220
power supply 2.5,2.5/3.3 V 2.5,2.5/3.3 V
Programmable logic type LOADABLE PLD LOADABLE PLD
propagation delay 0.6 ns 0.7 ns
Certification status Not Qualified Not Qualified
Maximum seat height 2.1 mm 4.1 mm
Maximum supply voltage 2.625 V 2.625 V
Minimum supply voltage 2.375 V 2.375 V
Nominal supply voltage 2.5 V 2.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING
Terminal pitch 1 mm 0.5 mm
Terminal location BOTTOM QUAD
Maximum time at peak reflow temperature 30 30
width 17 mm 28 mm

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