935307548125 datasheet, PDF - EEWORLD Datasheet

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935307548125: DescriptionIC BUFFER DUAL LP LV XSON6; Categorylogic logic; File Size759KB，17 Pages; ManufacturerNexperia; Websitehttps://www.nexperia.com; Environmental Compliance

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935307548125 Overview

IC BUFFER DUAL LP LV XSON6

935307548125 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Nexperia
package instruction	XSON-6
Reach Compliance Code	compliant
series	AUP/ULP/V
JESD-30 code	R-PDSO-N6
JESD-609 code	e3
length	1.45 mm
Logic integrated circuit type	BUFFER
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	20.8 ns
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.1 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1 mm

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74AUP2G16

Low-power dual buffer

Rev. 2 — 7 October 2016

Product data sheet

1. General description

The 74AUP2G16 provides two low-power, low-voltage buffers.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall

times across the entire V

range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire

range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

2. Features and benefits



Wide supply voltage range from 0.8 V to 3.6 V



High noise immunity



Complies with JEDEC standards:



JESD8-12 (0.8 V to 1.3 V)



JESD8-11 (0.9 V to 1.65 V)



JESD8-7 (1.2 V to 1.95 V)



JESD8-5 (1.8 V to 2.7 V)



JESD8-B (2.7 V to 3.6 V)



ESD protection:



HBM JESD22-A114F Class 3A exceeds 5000 V



MM JESD22-A115-A exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Low static power consumption; I

= 0.9

A

(maximum)



Latch-up performance exceeds 100 mA per JESD 78 Class II



Inputs accept voltages up to 3.6 V



Low noise overshoot and undershoot < 10 % of V



OFF

circuitry provides partial Power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

935307548125 Related Products

	935307548125	935307549125	74AUP2G16GMH	74AUP2G16GWH	74AUP2G16GFH	935307547125
Description	IC BUFFER DUAL LP LV XSON6	IC BUFFER DUAL LP LV XSON6	IC BUFFER NON-INVERT 3.6V 6XSON	IC BUFFER NON-INVERT 3.6V SC88	IC BUFFER NON-INVERT 3.6V 6XSON	IC BUFFER DUAL LP LV SC-88
package instruction	XSON-6	VSON,	VSON,	TSSOP,	VSON,	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-PDSO-N6	S-PDSO-N6	R-PDSO-N6	R-PDSO-G5	S-PDSO-N6	R-PDSO-G5
length	1.45 mm	1 mm	1.45 mm	2 mm	1 mm	2 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	2	2	2	2	2	2
Number of entries	1	1	1	1	1	1
Number of terminals	6	6	6	5	6	5
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	VSON	VSON	TSSOP	VSON	TSSOP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
propagation delay (tpd)	20.8 ns	20.8 ns	20.8 ns	20.8 ns	20.8 ns	20.8 ns
Maximum seat height	0.5 mm	0.5 mm	0.5 mm	1.1 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	NO LEAD	NO LEAD	NO LEAD	GULL WING	NO LEAD	GULL WING
Terminal pitch	0.5 mm	0.35 mm	0.5 mm	0.65 mm	0.35 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	1 mm	1 mm	1 mm	1.25 mm	1 mm	1.25 mm
Base Number Matches	-	1	1	1	-	1

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