TYPE
KAB
(P-KAB-E003)
Type KAB micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit
around battery, etc. because the demand for high capacity batteries is increasing.
Further miniaturization and low profile with extended rated range can be used for wider application.
Also, the ecology design of Type KAB is friendly to environment due to complete lead free.
FEATURES
1. New type fuses were developed by our original technology. They show no variation in fusing characteristics and have excellent
fast-blow capability.
2. Surface temperature rise is 75°C or less when applying rated current. This offers less influence on the peripheral units.
3. The fuses come in ultra-small size 1608 (1.6×0.8×0.45 mm) and 2012 (2.0×1.25×0.5 mm).
4. Suitable for automatic mounting
5. Precise dimensions allows high-density mounting and symmetrical construction of terminals provide “Self-Alignment”.
6. Resistance to soldering heat : Reflow or flow soldering 10 seconds at 260°C
7. High accuracy carrier tape by using pressed pocket paper ensures excellent mounting.
8. LEAD-FREE and RoHS Compliant
RATING
Item
Category Temperature Range
Rated Current
2.0×1.25
Rated Voltage
Voltage Drop
Insulation Resistance
(between Terminals and Case)
Fusing Characteristics
Clearing Characteristics
0.2-0.25-0.315-0.4-0.5-0.63-0.8-1.0-1.25-1.6-2.0-2.5-3.15-4.0-5.0A
24VDC, 32VDC, 50VDC
Refer to CATALOG NUMBERS AND RATING
1000MΩ or more
Fusing within 1 min if the current is 200% of rated current.
Breaking voltage
：
24V, 32V, 50V
Breaking current
：
50A
-40 ½
+125℃
1.6×0.8
0.2-0.25-0.315-0.4-0.5-0.63-0.8-1.0-1.25-1.6-2.0-2.5-3.15-4.0-5.0-6.3A
Rating
ORDERING INFORMATION
KAB
3202
102
NA
29
010
Type
KAB
Code
2402
3202
5002
Voltage
24V
32V
50V
Code Rated current
201
251
321
401
501
631
801
102
0.2 A
0.25 A
0.315 A
0.4 A
0.5 A
0.63 A
0.8 A
1.0 A
Code Rated current
132
162
202
252
322
402
502
632
1.25 A
1.6 A
2.0 A
2.5 A
3.15 A
4.0 A
5.0 A
6.3 A
Code Packaging type
NA
φ180 Real
Code Case size
29
31
1.6 × 0.8
2.0 × 1.25
Special product code
010
※
※
The special product code 010 indicates lead-free terminals.
1
PERFORMANCE
No.
1
2
3
4
5
6
7
Item
Temperature rise
Current-carrying capacity
Clearing characteristics
Voltage drop
Fusing characteristics
Insulation resistance
Electrode strength
(Bending)
Performance
Temperature rise shall not exceed 75°C.
Shall not open within 1 hour.
Arc shall not be continued.
Marking shall be legible.
Voltage drop is below the value specified in CATALOG
NUMBERS AND RATING.
Fusing within 1 min.
1000 MΩ or more
No mechanical damage.
Resistance change after the test shall be within
±
20%
Test method
Apply rated current.
Apply rated current.
Breaking voltage : Rated voltage
Breaking current : 50 A
Apply rated current.
Apply 200% of rated current.
(Ambient temperature : 10 ~ 30°C)
Insulation resistance between terminals and case
(alumina ceramic)
Board supporting width : 90 mm
Bending speed : Approx. 0.5 mm/sec
Duration : 30 sec
Bending : 3 mm
Applied force : 20 N (2.04 kgf)
Duration : 10 sec
Tool : R0.5
Direction of the press : side face
Supporting dimension : 1.2 mm (size 2012)
0.8 mm (size 1608)
Applied force : 10 N (1.02 kgf)
Tool : R0.5
Direction of the press : thickness direction of product
Solder : Sn–3Ag–0.5Cu
Temperature : 245
±
3°C
meniscograph method
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230
±
2°C
meniscograph method
Solder : Sn–3Ag–0.5Cu
Temperature : 245
±
3°C
Dipping : 3 sec.
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230
±
2°C
Dipping : 3 sec.
Dipping (1 cycle)
Preconditioning : 100 ~ 150°C, 60 sec
Temperature : 265
±
3°C /6 ~ 7 sec
Reflow soldering (2 cycles)
Preconditioning : 1 ~ 2 min, 180°C or less
Peak : 260°C max, 5 sec
Holding : 230 ~ 250°C, 30 ~ 40 sec
Cooling : more than 2 min
Manual soldering
Temperature : 400
±
10°C
Duration : 3 ~ 4 sec
Measure after 1 hour left under room temp. and humidity.
Dipping rinse
Solvent : Isopropyl alcohol
Duration : 90 sec
2
Ultrasonic : 20mW/cm 28kHz
Solvent : Isopropyl alcohol
Duration : 60 sec
Frequency range : 10 ~ 55 ~ 10 Hz/min
Vibration amplitude : 1.5 mm
Duration : 2 hours in each of XYZ directions (total : 6 hours)
2
Peak value : 490 m/s (50 G)
Duration : 11 m sec
6 aspects
×
3 times (total : 18 times)
–55
±
3°C : 30 min
Room temperature : 2 ~ 3 min or les
125
±
2°C : 30 min
Room temperature : 2 ~ 3 min or less
Repeat above step for 10 cycles.
Temperature : 35
±
2°C
Concentration (weight ratio) : 5
±
1%
Duration : 24 hours
Temperature : 85
±
3°C
Humidity : 85
±
5% RH
Duration : 1000 hours
Temperature : 85
±
2°C
Applied current : Rated current
×
70%
Duration : 1000 hours
Temperature : 125
±
2°C
Duration : 1000 hours
Temperature : 85
±
3°C
Humidity : 85
±
5% RH
Applied current : Rated current
×
70%
Duration : 1000 hours
8
Shear test
No mechanical damage.
Resistance change after the test shall be within
±
20%
9
Substrate bending test
No mechanical damage.
Resistance change after the test shall be within
±
20%
10
Solderability
(Solder Wetting time)
Solder Wetting time : within 3sec.
11
Solderability
(new uniform coating of solder)
The dipping surface of the terminals shall be covered
more than 95% with new solder.
12
Resistance to soldering heat
Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within
±
20%
13
14
15
16
Solvent resistance
Ultrasonic Cleaning
Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within
±
20%
Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within
±
20%
No mechanical damage.
Resistance change after the test shall be within
±
20%
No mechanical damage.
Resistance change after the test shall be within
±
20%
Vibration
Shock
17
Thermal shock
No mechanical damage.
Resistance change after the test shall be within
±
20%
18
19
20
21
22
Atomizing salt water
No mechanical damage.
Resistance change after the test shall be within
±
20%
No mechanical damage.
Resistance change after the test shall be within
±
20%
No mechanical damage.
Resistance change after the test shall be within
±
20%
No mechanical damage.
Resistance change after the test shall be within
±
20%
Moisture resistance
Load life
Stability
Accelerated
steady state
damp
heat
No mechanical damage.
Resistance change after the test shall be within
±
20%
3
Microcontroller MCU
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