LSI53C897 datasheet, PDF - EEWORLD Datasheet

LSI53C897: DescriptionSCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，362 Pages; ManufacturerBroadcom

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LSI53C897 Overview

SCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329

Parameter Name	Attribute value
Maker	Broadcom
package instruction	BGA,
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Address bus width	32
Bus compatibility	PCI
maximum clock frequency	33.33 MHz
Maximum data transfer rate	160 MBps
Drive interface standards	X3.131
External data bus width	32
JESD-30 code	S-PBGA-B329
JESD-609 code	e0
length	31 mm
Number of terminals	329
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	2.52 mm
Maximum supply voltage	3.47 V
Minimum supply voltage	3.13 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	31 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI

TECHNICAL

MANUAL

LSI53C897

PCI to Dual Channel

Ultra2 SCSI

Multifunction Controller

Version 2.0

April 2001

S14060

	LSI53C897
Description	SCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329
Maker	Broadcom
package instruction	BGA,
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Address bus width	32
Bus compatibility	PCI
maximum clock frequency	33.33 MHz
Maximum data transfer rate	160 MBps
Drive interface standards	X3.131
External data bus width	32
JESD-30 code	S-PBGA-B329
JESD-609 code	e0
length	31 mm
Number of terminals	329
Maximum operating temperature	70 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	2.52 mm
Maximum supply voltage	3.47 V
Minimum supply voltage	3.13 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	31 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI

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