D/A Converter, 16-Bit, 1 Func, Hybrid, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Burr-Brown |
| Reach Compliance Code | unknown |
| Converter type | D/A CONVERTER |
| Enter bit code | COMPLEMENTARY OFFSET BINARY |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.006% |
| Number of digits | 16 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,+-15 V |
| Certification status | Not Qualified |
| Maximum stabilization time | 8 µs |
| Maximum slew rate | 68 mA |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DAC703VG | DAC703VL/883B | DAC703VG/883B | DAC703VL | |
|---|---|---|---|---|
| Description | D/A Converter, 16-Bit, 1 Func, Hybrid, CDIP24, | D/A Converter, 16-Bit, 1 Func, Hybrid, CQCC28, | D/A Converter, 16-Bit, 1 Func, Hybrid, CDIP24, | D/A Converter, 16-Bit, 1 Func, Hybrid, CQCC28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Burr-Brown | Burr-Brown | Burr-Brown | Burr-Brown |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY |
| JESD-30 code | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.006% | 0.006% | 0.006% | 0.006% |
| Number of digits | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 24 | 28 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | DIP | QCCN |
| Encapsulate equivalent code | DIP24,.6 | LCC28,.45SQ | DIP24,.6 | LCC28,.45SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| power supply | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum stabilization time | 8 µs | 8 µs | 8 µs | 8 µs |
| Maximum slew rate | 68 mA | 68 mA | 68 mA | 68 mA |
| surface mount | NO | YES | NO | YES |
| technology | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
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