CAT34WC02JA-2.7 datasheet, PDF

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CAT34WC02JA-2.7: DescriptionEEPROM, 256X8, Serial, CMOS, PDSO8; Categorystorage storage; File Size635KB，9 Pages; ManufacturerCatalyst; Websitehttp://www.catalyst-semiconductor.com/

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CAT34WC02JA-2.7 Overview

EEPROM, 256X8, Serial, CMOS, PDSO8

CAT34WC02JA-2.7 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Catalyst
package instruction	SOP, SOP8,.25
Reach Compliance Code	unknow
ECCN code	EAR99
Data retention time - minimum	100
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDSO-G8
JESD-609 code	e0
memory density	2048 bi
Memory IC Type	EEPROM
memory width	8
Number of terminals	8
word count	256 words
character code	256
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	256X8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
power supply	3/5 V
Certification status	Not Qualified
Serial bus type	I2C
Maximum standby current	9e-7 A
Maximum slew rate	0.003 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
write protect	HARDWARE/SOFTWARE

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Description	EEPROM, 256X8, Serial, CMOS, PDSO8	EEPROM, 256X8, Serial, CMOS, PDIP8	EEPROM, 256X8, Serial, CMOS, PDSO8	EEPROM, 256X8, Serial, CMOS, PDIP8	EEPROM, 256X8, Serial, CMOS, PDSO8	EEPROM, 256X8, Serial, CMOS, PDSO8	EEPROM, 256X8, Serial, CMOS, PDSO8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst	Catalyst
package instruction	SOP, SOP8,.25	DIP, DIP8,.3	SOP, SOP8,.25	DIP, DIP8,.3	TSSOP, TSSOP8,.25	TSSOP, TSSOP8,.25	TSSOP, TSSOP8,.25
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown
Data retention time - minimum	100	100	100	100	100	100	100
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	2048 bi	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of terminals	8	8	8	8	8	8	8
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256
Maximum operating temperature	105 °C	105 °C	85 °C	85 °C	70 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C
organize	256X8	256X8	256X8	256X8	256X8	256X8	256X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP	DIP	TSSOP	TSSOP	TSSOP
Encapsulate equivalent code	SOP8,.25	DIP8,.3	SOP8,.25	DIP8,.3	TSSOP8,.25	TSSOP8,.25	TSSOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum standby current	9e-7 A	9e-7 A	9e-7 A	9e-7 A	9e-7 A	9e-7 A	9e-7 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
surface mount	YES	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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