DPS256X32AV3-35C datasheet, PDF

DPS256X32AV3-35C: DescriptionSRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66; Categorystorage storage; File Size60KB，2 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS256X32AV3-35C Overview

SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	B&B Electronics Manufacturing Company
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	35 ns
Other features	USER CONFIGURABLE AS 1M X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
memory density	8388608 bi
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	66
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	10.16 mm
Maximum standby current	0.0008 A
Minimum standby current	2 V
Maximum slew rate	0.48 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR

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