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DPS512M8MKHY-20I

Description
SRAM Module, 512KX8, 20ns, CMOS, CQMA52, GULLWING, SLCC-52
Categorystorage    storage   
File Size710KB,8 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS512M8MKHY-20I Overview

SRAM Module, 512KX8, 20ns, CMOS, CQMA52, GULLWING, SLCC-52

DPS512M8MKHY-20I Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codeQMA
package instruction,
Contacts52
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time20 ns
JESD-30 codeR-CQMA-G52
memory density4194304 bi
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals52
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal locationQUAD
4 Megabit High Speed CMOS SRAM
DPS512M8MKnY
DESCRIPTION:
The DPS512M8MKnY High Speed SRAM ‘’STACK’’ devices are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The device packs 4-Megabits of low-power CMOS static
RAM in an area as small as 0.549 in
2
, while maintaining a total
height as low as 0.062 inches.
The DPS512M8MKnY STACK devices contain an individual
512K x 8 SRAM die, packaged in a hermetically sealed SLCC,
making the devices suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of devices offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
SLCC Stack
Straight
Leaded
Stack
FEATURES:
Organizations Available:
512K x 8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
*
Commercial and Industrial Grade only.
‘’J’’ Leaded
Stack
Gullwing
Leaded
Stack
FUNCTIONAL BLOCK DIAGRAM
A0 - A18
I/O0 - I/O7
CE
WE
OE
V
DD
V
SS
N.C.
PIN NAMES
Address Inputs
Data Input/Output
Low Chip Enable
Write Enable
Output Enable
Power (+5V)
Ground
No Connect
30A129-01
REV. B
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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