capability combined with a very low on-resistance for
specialized applications.
PAA140
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 8-Pin Package
•
Machine Insertable, Wave Solderable
•
Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
PAA140
PAA140P
PAA140PTR
PAA140S
PAA140STR
Description
8-Lead DIP (50/tube)
8-Lead Flatpack (50/tube)
8-PLead Flatpack (1000/Reel)
8-Lead Surface Mount (50/tube)
8-Lead Surface Mount (1000/Reel)
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-PAA140-R09
e
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1
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NTEGRATED
C
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D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PAA140
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous *
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=250mA
V
L
=400V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
6
-
-
-
-
0.7
1.2
-
3
250
±500
8
1
3
1
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
µA
I
F
=5mA, V
L
=10V
ms
I
L
=250mA
-
I
F
=5mA
V
R
=5V
-
mA
mA
V
µA
pF
*NOTE: If both poles operate simultaneously, then load current must be derated so that the package power dissipation value is not exceeded.
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=250mA
DC
)
PAA140
35
30
Device Count (N)
25
20
15
10
5
0
25
20
15
10
5
0
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=250mA
DC
)
Device Count (N)
Device Count (N)
1.17
1.19
1.21
1.23
1.25
0.39
0.65
0.91
1.17
1.43
1.69
1.95
0.018 0.030 0.042 0.054 0.066 0.078 0.090
Turn-Off Time (ms)
LED Forward Voltage Drop (V)
Turn-On Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=250mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=250mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=250mA
DC
)
Device Count (N)
1.5
2.1
2.7
3.3
3.9
4.5
5.1
Device Count (N)
0.9
1.5
2.1
2.7
3.3
3.9
4.5
5.03
5.38
5.73
6.08
6.43
6.78
7.13
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
430
442
454
466
478
490
502
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=250mA
DC
)
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=250mA
DC
)
10
15
20
25
30
35
40
45
50
Turn-Off Time (ms)
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R09
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NTEGRATED
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IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=250mA
DC
)
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=250mA
DC
)
On-Resistance ( )
PAA140
2.5
Turn-On Time (ms)
2.0
1.5
1.0
0.5
0
-40
-20
0.07
0.06
Turn-Off Time (ms)
10
9
8
7
6
5
4
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=250mA
DC
)
I
F
= 5mA
I
F
= 10mA
I
F
= 20mA
0.05
0.04
0.03
0.02
0.01
0
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
5.0
4.5
LED Current (mA)
4.0
3.5
3.0
2.5
2.0
1.5
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=250mA
DC
)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
LED Current (mA)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=250mA
DC
)
Load Current (mA)
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
250
200
150
100
50
0
-50
-100
-150
-200
-250
-2.0 -1.5
Typical Load Current vs. Load Voltage
(I
F
=5mA)
-1.0 -0.5
0
0.5
1.0
1.5
2.0
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
350
Load Current (mA)
300
250
200
150
100
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Blocking Voltage (V
P
)
485
480
Typical Blocking Voltage
vs. Temperature
0.12
0.10
Leakage ( A)
0.08
0.06
0.04
0.02
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
475
470
465
460
455
450
445
I
F
= 20mA
I
F
= 10mA
I
F
= 5mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
PAA140
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PAA140 / PAA140S / PAA140P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PAA140 / PAA140S
PAA140P
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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