EEWORLDEEWORLDEEWORLD

Part Number

Search

BD105-17A-1-0300-0250-0250-LE

Description
Board Connector
CategoryThe connector    The connector   
File Size348KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BD105-17A-1-0300-0250-0250-LE Overview

Board Connector

BD105-17A-1-0300-0250-0250-LE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGlobal Connector Technology
Reach Compliance Codecompli
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD FLASH
Contact completed and terminatedGOLD FLASH
Contact materialCOPPER ALLOY
JESD-609 codee4
Manufacturer's serial numberBD105
1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL
A
A
B
C
D
E
SPECIFICATIONS
规格:
CURRENT RATING
电流额定值:
1 AMP
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MEGOHMS MIN.
03 to 33
F
DIELECTRIC WITHSTANDING
耐电压:
AC 300 V
Contact Plating
CONTACT RESISTANCE
接触电阻值:
20m
Max.
A = Gold Flash All Over
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYESTER
聚酯
, LCP, UL 94-V0
G = 10µ" Gold Contact Area/Tin On Tail
OPTIONS
可选物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
Standard = Gold Flash All Over
LCP (STANDARD
标准物料
) -
G
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
NYLON 6T (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BD074
BD075
BD080
BD090
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
28/12/07
PN
STANDARD INSULATOR
MATERIAL & PACKING
OPTIONS CHANGED
CB
PACKING OPTIONS SOLDER TEMP & MATES
WITH INFO. UPDATED
CHANGED
B
27/04/09
1
C
20/05/09
G CE
N N
I
D E
N SC
E E
P L
O
S
B
GC
O
Ordering Grid
B
C
D
E
BD105
XX X
X
XXXX
XXXX
XXXX
X
X
Type
1 = R1 Type
2 = R2 Type
Packing Options
B = Tape and Reel with Cap (Standard)
D = Tube (Standard - where height exceeds 25mm)
E = Tube with Cap
Insulator Material
L = LCP (Standard)
N = Nylon 6T
F
Dimension C (1/100mm)
(Post Height)
Standard - 3.00mm = 0300
or specify Dimension C
e.g. 2.50mm = 0250
Tol +/- 0.2mm
Dimension D (1/100mm)
(Stack Height)
Standard - 4.60mm = 0460
Please Specify Dimension D
e.g. 2.5mm = 0250
Tol +/- 0.2mm
Part Number:-
Dimension E (1/100mm)
(Footprint Width)
Standard - 4.50mm = 0450
or specify Dimension E
e.g. 2.50mm = 0250
Tol +/- 0.2mm
G
Tolerances
(Except as noted)
Date:-
Dimensions in mm
BD105
28 DEC 07
AE
2
D
27/07/09
AE
DIMENSION
AMMENDED
E
27/08/09
3
AJO
BD105
X PCN
X
15/05/14
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
Description:-
H
Sheet No.
1/1
1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW
SURFACE MOUNT, VERTICAL
www.globalconnectortechnology.com
Material
Drawn by
LYH
X
See Note
E & OE
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Scale
NTS
Revision
4
5
6
7
8
Question + Have you considered copyright issues for the e-books you share?
Isn't it a bit unfair to the author's efforts? After all, writing a book requires a lot of effort. As a student, I just want to see what everyone thinks...
hu_uuu Download Centre
<> e-book
...
eeleader FPGA/CPLD
Urgent! Urgent! Experts, please help me
I wrote this in the firmware program: StringDscr1: db StringDscr1End-StringDscr1 ;; String descriptor length db DSCR_STRING db 'C',00 db 'y',00 db 'p',00 db 'r',00 db 'e',00 db 's',00 db 's',00 String...
情场探花 Embedded System
Wince desktop icons and toolbars are blurred
Wince can run, but the icons and toolbars of the graphical interface are very blurry. Can an expert tell me where this problem lies? Thank you....
472438470 Embedded System
Microcontroller learning: Development board is like the seeds that farmers plant in the fields (transferred)
Single-chip microcomputer is a very practical subject. Without practice, everything is "castles in the air". It is very necessary to spend some money to buy a development board. ("The development boar...
bootloader MCU
FPGA power consumption problem
I need some advice. My program needs a parameter from the host computer to start executing. The problem is that the current increases a lot immediately after the program is downloaded, and then it inc...
zhenpeng25 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 456  1634  13  695  2529  10  33  1  14  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号