Product Guide
F_1112H Series Thin Type AlInGaP SMT LED
s
Features
• Compact 2012 (0805) package with super bright AlInGaP die
• Excellent for membrane switch panels and indicators
s
Applications
• Mobile devices (cellular telephones, PDAs, pagers)
• Audio visual equipment
• Telecommunications
s
Outline Dimensions
PCB Warpage direction
Unit: mm
Tolerances + 0.1
s
Electro-Optical Characteristics
Part No.
Material Emitted Lens
Color Color
AlInGaP
AlInGaP
AlInGaP
Red
Orange
Yellow
Milky
White
(Ta=25°C)
Wavelength
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Luminous
Intensity
IV
MIN.
TYP.
I
F
Forward
Voltage
V
TYP.
MAX.
F
Reverse Viewing
Current
IR
Angle
I
F
MAX.
V
R
(2
θ
1/2)
FR1112H
FA1112H
FY1112H
25
25
25
50
65
65
20
20
20
mA
635
609
592
626
605
590
nm
15
15
15
20
20
20
mA
1.9
1.9
1.9
V
2.4
2.4
2.4
20
20
20
mA
100
100
100
µA
5
5
5
V
Deg.
150°
Units
mcd
s
Absolute Maximum Ratings
Red
Orange
FA
81
30
100
5
-40 to +85
-40 to +100
0.43 (DC) 1.0 (Pulse)
Yellow
(Ta=25°C)
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
FR
81
30
100
5
FY
81
30
100
5
Units
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
1.75+0.1
s
Operation Current Derating Chart (DC)
8+0.2
4+0.1
(1.45)
φ
1.5
+0.1
0
(0.2)
(φ 0.5)
2+0.05
4+0.1
(2.25)
Quantity on tape:
Quantity on tape:
4000 pieces
4000 pieces
per reel
per reel
(1)
2+0.5
φ
21+0.8
FR, FA, FY
Center
Hole
3.5+0.05
Direction to pull
+1
φ
60 -0
φ
13+0.2
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120° ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1112H-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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