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AE235RAA2N4FSN

Description
General Purpose Inductor, 0.0024uH, 1%, 1 Element, Ceramic-Core, SMD, 0402, CHIP
CategoryPassive components    inductor   
File Size149KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AE235RAA2N4FSN Overview

General Purpose Inductor, 0.0024uH, 1%, 1 Element, Ceramic-Core, SMD, 0402, CHIP

AE235RAA2N4FSN Parametric

Parameter NameAttribute value
MakerCOILCRAFT
package instruction0402
Reach Compliance Codecompli
ECCN codeEAR99
uppercase and lowercase codes0402
structureRectangul
core materialCERAMIC
DC Resistance0.068 Ω
Nominal inductance(L)0.0024 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.66 mm
Package length1.19 mm
Package formSMT
Package width0.64 mm
method of packingTR, Paper, 7 Inch
Minimum quality factor (at nominal inductance)20
Maximum rated current0.6 A
self resonant frequency5000 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance1%
0402 CHIP INDUCTORS
OutgassingCompliantChipInductors
AE235RAA
Exceptionally high Q factors
Outstanding self-resonant frequency
Tight inductance tolerance
High temperature materials allow operation in ambient
temperatures up to 155°C.
Passes NASA low outgassing specifications
Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
Current Derating
120
110
100
Percent of rated
I
rms
90
80
70
60
50
Typical L vs Frequency
30
27 nH
25
30
20
10
0
-55 -40
Inductance (nH)
20
19 nH
-20
0
20
25°C
40
40
60
80
100
120
140 160
Ambient temperature (°C)
B
overall
C
D
Pick and
place
surface
I
15
12 nH
10
5.6 nH
H
F
A
5
0
1
10
G
F
J
I
1 nH
100
1000
10000
Frequency (MHz)
Typical Q vs Frequency
120
110
100
90
80
12 nH
5.6 nH
19 nH
27 nH
1 nH
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
A
max
0.047
1,19
B
max
0.025
0,64
C
max
0,66
D
ref
0,25
E
0,51
F
0,23
G
0,56
H
0,66
I
0,36
J
0,46
0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q Factor
70
60
50
40
30
20
10
0
1
10
100
1000
10000
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
®
Frequency (MHz)
Parts shown are preproduction products available for evaluation only.
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
Document AE198-2 Revised 06/14/13
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
© Coilcraft, Inc. 2013
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