|
TMS320VC5501PGF300 |
TMS320VC5501GZZ300 |
TMS320VC5501ZZZ300 |
| Description |
Fixed-Point Digital Signal Processor 176-LQFP -40 to 85 |
Fixed-Point Digital Signal Processor 201-BGA MICROSTAR -40 to 85 |
Fixed-Point Digital Signal Processor 201-BGA MICROSTAR -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFP |
BGA |
BGA |
| package instruction |
LFQFP, QFP176,1.0SQ,20 |
LFBGA, BGA201,17X17,32 |
LFBGA, BGA201,17X17,32 |
| Contacts |
176 |
201 |
201 |
| Reach Compliance Code |
compliant |
_compli |
compli |
| ECCN code |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
| Factory Lead Time |
1 week |
1 week |
1 week |
| Other features |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
| Address bus width |
22 |
22 |
22 |
| barrel shifter |
NO |
NO |
NO |
| bit size |
16 |
16 |
16 |
| boundary scan |
YES |
YES |
YES |
| maximum clock frequency |
50 MHz |
50 MHz |
50 MHz |
| External data bus width |
32 |
32 |
32 |
| Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
| Integrated cache |
YES |
YES |
YES |
| Internal bus architecture |
MULTIPLE |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PQFP-G176 |
S-PBGA-B201 |
S-PBGA-B201 |
| JESD-609 code |
e4 |
e0 |
e1 |
| length |
24 mm |
15 mm |
15 mm |
| low power mode |
YES |
YES |
YES |
| Humidity sensitivity level |
4 |
3 |
3 |
| Number of DMA channels |
6 |
6 |
6 |
| Number of external interrupt devices |
4 |
4 |
4 |
| Number of terminals |
176 |
201 |
201 |
| Number of timers |
4 |
4 |
4 |
| On-chip data RAM width |
16 |
16 |
16 |
| On-chip program ROM width |
16 |
16 |
16 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFQFP |
LFBGA |
LFBGA |
| Encapsulate equivalent code |
QFP176,1.0SQ,20 |
BGA201,17X17,32 |
BGA201,17X17,32 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
220 |
260 |
| power supply |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (number of words) |
16384 |
16384 |
16384 |
| ROM programmability |
MROM |
MROM |
MROM |
| Maximum seat height |
1.6 mm |
1.4 mm |
1.4 mm |
| Maximum slew rate |
239 mA |
239 mA |
239 mA |
| Maximum supply voltage |
1.32 V |
1.32 V |
1.32 V |
| Minimum supply voltage |
1.2 V |
1.2 V |
1.2 V |
| Nominal supply voltage |
1.26 V |
1.26 V |
1.26 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn/Pb) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
GULL WING |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.8 mm |
0.8 mm |
| Terminal location |
QUAD |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
24 mm |
15 mm |
15 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches |
1 |
1 |
1 |
| Is it lead-free? |
Lead free |
- |
Lead free |
| Is it Rohs certified? |
conform to |
- |
conform to |