Multiplexer, 1-Func, 16 Line Input, TTL, CDIP24,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Reach Compliance Code | compli |
| series | TTL/H/L |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| Number of functions | 1 |
| Number of entries | 16 |
| Output times | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| 74150DC | 54150DM | 74150FC | 74150PC | |
|---|---|---|---|---|
| Description | Multiplexer, 1-Func, 16 Line Input, TTL, CDIP24, | Multiplexer, 1-Func, 16 Line Input, TTL, CDIP24, | Multiplexer, 1-Func, 16 Line Input, TTL, CDFP24, | Multiplexer, 1-Func, 16 Line Input, TTL, PDIP24 |
| Reach Compliance Code | compli | unknown | compliant | unknow |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | R-PDIP-T24 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of entries | 16 | 16 | 16 | 16 |
| Number of terminals | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DFP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - |
| Maker | Fairchild | - | Fairchild | Fairchild |
| JESD-609 code | e0 | e0 | e0 | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Embedded System
Microcontroller MCU
Microcontroller MCU
PCB Design
Embedded System
Analog electronics
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