Inverter, CMOS, CDFP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | INVERTER |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5/15 V |
| Prop。Delay @ Nom-Su | 400 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| MM54C914W/883 | 40014BDMQB | 40014BDCQM | 40014BDCQR | 40014BDM | DIP-U1999-11-2371-A-Q-1 | MM54C14W/883 | MM54C14J/883 | MM54C14J | MM54C914J/883 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Inverter, CMOS, CDFP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, | Array/Network Resistor, Isolated, Thin Film, 0.04W, 2370ohm, 50V, 0.05% +/-Tol, -15,15ppm/Cel, 8025, | Inverter, CMOS, CDFP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, | Inverter, CMOS, CDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | conform to | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknow | compliant | compliant | compliant | unknown | compliant | unknown | unknown | unknown | unknow |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e4 | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 16 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | DIP | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| surface mount | YES | NO | NO | NO | NO | NO | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | THIN FILM | CMOS | CMOS | CMOS | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | - | Fairchild | Fairchild | Fairchild | Fairchild |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | - | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | - | INVERTER | INVERTER | INVERTER | INVERTER |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP | DIP | - | DFP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | YES | YES | YES | YES | YES | - | YES | YES | YES | YES |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| Prop。Delay @ Nom-Sup | - | 200 ns | 200 ns | 200 ns | 200 ns | - | 400 ns | 400 ns | 400 ns | - |