Chip Zener Diode
ZS100 THRU ZS330
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3
Rating and characteristic curves........................................................ 4
Pinning information........................................................................... 5
Suggested solder pad layout............................................................. 5
Packing information.......................................................................... 6
Reel packing.................................................................................... 7
Suggested thermal profiles for soldering processes............................. 7
High reliability test capabilities........................................................... 8
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/10/05
Revision
D
Page.
8
Page 1
DS-121711
Chip Zener Diode
ZS100 THRU ZS330
1000mW Surface Mount Zener
Diodes - 100V-330V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Glass passivated chip junction.
Typical IR less than 0.5µA above 100V.
Standard zener voltage tolerance ±5%.
Low inductance.
Low profile package.
Built-in strain relief.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free part, ex.ZS100B-H.
Formosa MS
Package outline
SMA
0.196(4.9)
0.180(4.5)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
Mechanical data
0.032(0.8) Typ.
0.068(1.7)
0.060(1.5)
0.032 (0.8) Typ.
•
Epoxy : UL94-V0 rated flame retardant
•
Case : Molded plastic,JEDEC DO-214AC / SMA
•
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.05 gram
Maximum ratings
(at T =25 C unless otherwise noted)
o
A
PARAMETER
Forward voltage
Power Dissipation
Operating temperature
Storage temperature
I
F
= 200 mA DC
CONDITIONS
Symbol
V
F
P
D
T
J
T
STG
MIN.
TYP.
MAX.
1.20
1000
UNIT
V
mW
o
-55
-65
+150
+175
C
C
o
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/10/05
Revision
D
Page.
8
Page 2
DS-121711
Chip Zener Diode
ZS100 THRU ZS330
Electrical characteristics
(at T
A
=25
o
C unless otherwise noted)
Zener
voltage
Part No.
Marking
code
Min. V
Z
@ I
ZT
Nom. V
Z
@ I
ZT
Max. V
Z
@ I
ZT
Volts
ZS100B
ZS105B
ZS110B
ZS115B
ZS120B
ZS130B
ZS140B
ZS150B
ZS160B
ZS170B
ZS180B
ZS190B
ZS200B
ZS210B
ZS220B
ZS230B
ZS240B
ZS250B
ZS260B
ZS270B
ZS280B
ZS290B
ZS300B
ZS310B
ZS320B
ZS330B
Z100
Z105
Z110
Z115
Z120
Z130
Z140
Z150
Z160
Z170
Z180
Z190
Z200
Z210
Z220
Z230
Z240
Z250
Z260
Z270
Z280
Z290
Z300
Z310
Z320
Z330
95
99.75
104.5
109.25
114
123.5
133
142.5
152
161.5
171
180.5
190
199.5
209
218.5
228
237.5
247
256.5
266
275.5
285
294.5
304
313.5
Volts
100
105
110
115
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
270
280
290
300
310
320
330
Volts
105
110.25
115.5
120.75
126
136.5
147
157.5
168
178.5
189
199.5
210
220.5
231
241.5
252
262.5
273
283.5
294
304.5
315
325.5
336
346.5
Test
current
I
ZT
mA
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
Z
ZT
@ I
ZT
OHMs
750
750
750
750
850
1000
1200
1300
1500
2200
2200
2500
2500
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
Zener
impedance
Z
ZK
@ I
ZK
OHMs
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
8000
9000
9000
9000
9000
9000
9000
9000
9000
9000
9000
9000
9000
9000
Formosa MS
Leakage
current
I
ZK
mA
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
I
R
µA
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
V
R
Volts
75
77
80
85
90
95
105
110
120
130
140
150
165
165
170
175
180
190
195
200
210
215
220
225
233
240
Note :
20% tolerance of Zener voltage for no suffix ex: ZS110
10% tolerance of Zener voltage for suffix "A" ex: ZS110A
5% tolerance of Zener voltage for suffix "B" ex: ZS110B
+5%, -0% tolerance of Zener voltage for suffix "C" ex: ZS110C
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/10/05
Revision
D
Page.
8
Page 3
DS-121711
Rating and characteristic curves (ZS100 THRU ZS330)
FIG.1-TOTAL POWER DISSIPATION VS.
AMBIENT TEMPERATURE
REVERSE POWER DISSIPATION (mW)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
1200
1000
INSTANTANEOUS FORWARD CURRENT,(A)
800
600
400
200
0
0
40
80
120
o
10
1.0
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
160
200
LEAD TEMPERATURE ( C)
0.1
.01
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
100
.6
.7
.8
.9
1.0
1.1
1.2
1.3
FORWARD VOLTAGE,(V)
REVERSE LEAKAGE CURRENT, (m
A)
10
VZ TEMPERATURE COEFFICIENT @ IZT, mV/K
FIG.4 - TYPICAL TEMPERATURE COEFFICIENTS
1000
500
200
100
50
20
10
10
20
50
100
200
500
1000
VZ, ZENER VOLTAGE @ IZT, VOLTS
1.0
.1
T
J
=25 C
.01
0
20
40
60
80
100 120 140
PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/10/05
Revision
D
Page.
8
Page 4
DS-121711
Chip Zener Diode
ZS100 THRU ZS330
Formosa MS
Pinning information
Pin
Pin1
Pin2
cathode
anode
Simplified outline
Symbol
1
2
1
2
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMA
A
0.110 (2.80)
B
0.063 (1.60)
C
0.087 (2.20)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/10/05
Revision
D
Page.
8
Page 5
DS-121711
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