EEWORLDEEWORLDEEWORLD

Part Number

Search

HB56G51232SB-8CL

Description
Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72
Categorystorage    storage   
File Size77KB,7 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HB56G51232SB-8CL Overview

Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72

HB56G51232SB-8CL Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
Parts packaging codeSIMM
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS REFRESH
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density16777216 bi
Memory IC TypeFAST PAGE DRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals72
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height20.32 mm
self refreshNO
Maximum standby current0.0008 A
Maximum slew rate0.26 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
HB56G51232 Series
524,288-word
×
32-bit High Density Dynamic RAM Module
ADE-203-
Rev. 0.0
Dec. 1, 1995
Description
The HB56G51232B/SB is a 512 k
×
32 dynamic RAM module, mounted 4 pieces of 4-Mbit DRAM
(HM514260CJ/CLJ) sealed in SOJ package. An outline of the HB56G51232B/SB is 72-pin single in-line
package. Therefore, the HB56G51232B/SB makes high density mounting possible without surface mount
technology. The HB56G51232B/SB provides common data inputs and outputs. Decoupling capacitors are
mounted beside each SOJ.
Features
72-pin single in-line package
– Lead pitch: 1.27 mm
Single 5 V (± 5%) supply
High speed
– Access time: 70 ns/80 ns (max)
Low power dissipation
– Active mode: 1.6 W/1.4 W (max)
– Standby mode: 42 mW (max)
4.2 mW (max) (L version)
Fast page mode capability
512 refresh cycle: 8 ms
128 ms (L-version)
2 variations of refresh
RAS-only
refresh
CAS-before-RAS
refresh
TTL compatible

HB56G51232SB-8CL Related Products

HB56G51232SB-8CL HB56G51232SB-8C HB56G51232B-8C HB56G51232SB-7CL HB56G51232B-7C HB56G51232B-7CL HB56G51232B-8CL HB56G51232SB-7C
Description Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
package instruction SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
Contacts 72 72 72 72 72 72 72 72
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 80 ns 80 ns 70 ns 70 ns 70 ns 80 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
memory density 16777216 bi 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bi
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72 72 72
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
Encapsulate equivalent code SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512
Maximum seat height 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm
self refresh NO NO NO NO NO NO NO NO
Maximum standby current 0.0008 A 0.004 A 0.004 A 0.0008 A 0.004 A 0.0008 A 0.0008 A 0.004 A
Maximum slew rate 0.26 mA 0.26 mA 0.26 mA 0.29 mA 0.29 mA 0.29 mA 0.26 mA 0.29 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO
technology MOS MOS MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2806  2432  1705  317  2242  57  49  35  7  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号