MASK ROM, 128KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44
| Parameter Name | Attribute value |
| Maker | Hitachi (Renesas ) |
| Parts packaging code | LCC |
| package instruction | QCCJ, |
| Contacts | 44 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| JESD-30 code | S-PQCC-J44 |
| length | 16.5862 mm |
| memory density | 2097152 bi |
| Memory IC Type | MASK ROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 16.5862 mm |





| HN62442BCP | HN62442BP | |
|---|---|---|
| Description | MASK ROM, 128KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44 | MASK ROM, 128KX16, 100ns, CMOS, PDIP40, PLASTIC, DIP-40 |
| Maker | Hitachi (Renesas ) | Hitachi (Renesas ) |
| Parts packaging code | LCC | DIP |
| package instruction | QCCJ, | DIP, |
| Contacts | 44 | 40 |
| Reach Compliance Code | unknow | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 100 ns | 100 ns |
| JESD-30 code | S-PQCC-J44 | R-PDIP-T40 |
| length | 16.5862 mm | 52.8 mm |
| memory density | 2097152 bi | 2097152 bit |
| Memory IC Type | MASK ROM | MASK ROM |
| memory width | 16 | 16 |
| Number of functions | 1 | 1 |
| Number of terminals | 44 | 40 |
| word count | 131072 words | 131072 words |
| character code | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 128KX16 | 128KX16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP |
| Package shape | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL |
| width | 16.5862 mm | 15.24 mm |