HC6364/3YSHZC datasheet, PDF - EEWORLD Datasheet

HC6364/3YSHZC: DescriptionStandard SRAM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36; Categorystorage storage; File Size690KB，16 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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HC6364/3YSHZC Overview

Standard SRAM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Honeywell
Parts packaging code	DFP
package instruction	DFP, FL36,.6,25
Contacts	36
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	S-CDFP-F36
JESD-609 code	e0
length	16.002 mm
memory density	65536 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	36
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL36,.6,25
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class S (Modified)
Maximum seat height	3.5052 mm
Maximum standby current	0.0003 A
Minimum standby current	2.5 V
Maximum slew rate	0.008 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
total dose	1M Rad(Si) V
width	16.002 mm

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