2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5.0 mm
Product Features:
Low Cost SMD Package
Low ESR
Compatible with Leadfree Processing
ILCX03 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
5.0
3.2
Frequency
ESR (Equivalent Series Resistance)
8.000 MHz – 12.000 MHz
12.000 MHz – 16.000 MHz
16.000 MHz – 20.000 MHz
20.000 MHz – 24.000 MHz
24.000 MHz – 40.000 MHz
rd
40.000 MHz – 60.000 MHz (3 O.T.)
rd
60.000 MHz –150.000 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
8.000 MHz to 150.000 MHz
1.3 Max.
1.3
80
Max.
60
Max.
50
Max.
40
Max.
30
Max.
100
Max.
80
Max
7 pF Max.
30
ppm Standard (see Part Number Guide for more options)
50
ppm Standard (see Part Number Guide for more options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 µW Max.
3
ppm Max. / Year Standard
2.00
Connection Diagram
Recommended pad layout
1.5
2.4
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
3.5
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX03 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX03 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard.
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/05/16_B
Page 1 of 2
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5.0 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX03 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000 or 3000
12 +/-.3
8 +/-.2
5.5 +/-.2
13.5 +/-1 or
12 +/-3
60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code (yww)
Line 2: XXXX
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/05/16_B
Page 2 of 2
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