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IRKCS220/030P

Description
Rectifier Diode, Schottky, 1 Phase, 2 Element, 220A, 30V V(RRM), Silicon, TO-240AA, ROHS COMPLIANT PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size164KB,6 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Environmental Compliance
Download Datasheet Parametric View All

IRKCS220/030P Overview

Rectifier Diode, Schottky, 1 Phase, 2 Element, 220A, 30V V(RRM), Silicon, TO-240AA, ROHS COMPLIANT PACKAGE-3

IRKCS220/030P Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerInternational Rectifier ( Infineon )
Parts packaging codeTO-240AA
package instructionR-XUFM-X3
Contacts3
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresHIGH RELIABILITY, FREE WHEELING DIODE
applicationGENERAL PURPOSE
Shell connectionISOLATED
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JEDEC-95 codeTO-240AA
JESD-30 codeR-XUFM-X3
Maximum non-repetitive peak forward current2000 A
Number of components2
Phase1
Number of terminals3
Maximum output current220 A
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum repetitive peak reverse voltage30 V
surface mountNO
technologySCHOTTKY
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperature40
Bulletin I27255 09/06
IRKCS220/030P
SCHOTTKY RECTIFIER
Description/ Features
The IRKCS220.. Schottky rectifier doubler module has been optimized for
low reverse leakage at high temperature. The proprietary barrier technology
allows for reliable operation up to 150°C junction temperature. Typical
applications are in high current switching power supplies, plating power
supplies, UPS systems, converters, free-wheeling diodes, welding, and
reverse battery protection.
150°C T
J
operation
Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
UL pending
TOTALLY LEAD-FREE, RoHS Compliant
-
(3)
(1)
220 Amp
+
-
(2)
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior me-
chanical ruggedness, thanks to the insertion of a solid
Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of sur-
face roughness and improve thermal spread.
The Generation V of AAP module is manufactured without
hard mold, eliminating in this way any possible direct
stress on the leads.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Major Ratings and Characteristics
Characteristics
I
F(AV)
Rectangular
waveform
V
RRM
I
FSM
@ tp = 5
μs
sine
V
F
T
J
@ 110Apk, T
J
=125°C
range
Values
220
30
18000
0.42
- 55 to 150
Units
A
V
A
V
°C
Outline TO-240AA
www.irf.com
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