EEWORLDEEWORLDEEWORLD

Part Number

Search

0805B333J250S

Description
Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.033uF, 0805,
CategoryPassive components    capacitor   
File Size56KB,4 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Download Datasheet Parametric View All

0805B333J250S Overview

Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.033uF, 0805,

0805B333J250S Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerKnowles
package instruction, 0805
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.033 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.37 mm
length2.03 mm
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingBulk
positive tolerance5%
Rated (DC) voltage (URdc)25 V
series0805B (25-50V)
size code0805
Temperature characteristic codeX7R
Temperature Coefficient-/+15ppm/Cel ppm/°C
width1.27 mm
X7R - COMMERCIAL - 16Vdc to 10KVdc
Stable EIA Class II dielectric, with +/-15% temperature
coefficient and predictable variation
of electrical properties with time, temperature and voltage.These chips are designed for sur-
face mount application with nickel barrier terminations suitable for solder wave, vapor
phase or reflow solder board attachment. Also available in silver-palladium terminations for
hybrid use with conductive epoxy. Class II X7R chips are used as decoupling, by-pass, filter-
ing and transient voltage suppression elements.
CAPACITANCE & VOLTAGE SELECTION FOR POPULAR CHIP SIZES
3 digit code: two significant digits, followed by number of zeros eg: 183 = 18,000 pF. R denotes decimal, eg. 2R7 = 2.7 pF
SIZE
Min Cap
0402 0504 0603 0805 1005 1206 1210 1515
121
.
024
1808
151
.065
684
564
394
274
184
124
823
563
563
393
273
153
472
272
821
331
151
.080
824
564
564
394
224
154
104
823
683
563
333
223
682
332
122
391
x
1812
151
.065
125
105
824
564
334
224
154
104
104
683
473
273
822
472
152
681
151
.100
155
125
125
824
564
394
224
184
154
124
683
473
153
682
272
122
x
1825
471
.080
185
155
155
125
824
684
474
334
334
224
124
823
273
123
472
152
821
471
.140
225
225
225
185
155
125
824
564
474
394
274
154
563
273
103
272
182
x
121
.044
393
333
333
333
153
103
121
.035
273
223
223
223
103
682
121
.054
124
104
104
683
333
273
153
123
123
822
472
272
121
.054
154
124
124
823
473
393
183
123
822
822
472
272
121
.064
334
274
274
184
104
683
473
273
223
183
103
682
222
102
121
.065
474
474
474
334
184
124
823
563
563
393
273
153
472
222
151
.130
125
105
824
684
564
394
274
224
154
124
823
563
183
822
332
122
Tmax
16V
25V
V O LTA G E
562
472
472
472
222
152
50V
100V
200V
250V
300V
400V
500V
CAP
MAX
&
600V
800V*
1000V*
1500V*
2000V*
3000V*
4000V*
5000V*
6000V*
7000V*
8000V*
9000V*
10000V*
Note:
x ”
denotes a special
thickness
(see Tmax
row above).
An
X is required in the part number. Please
refer to page
10 for how to order.
* Units rated above 800V may require conformal coating in use to preclude arcing over the chip surface
NOTE: REFER TO PAGES 10 & 11 FOR ORDERING INFORMATION
14
.
www.
N O V A C A P
.
com
14
Infineon Coolset switching power supply chip design information sharing
As the title says, share the information that I think is good...
elvike Power technology
Experts or experienced beginners please come in,
Does anyone have a well-adjusted 51 program for nrf24l01, or an enhanced microcontroller 12c5a60s2?...
魔尊123 RF/Wirelessly
HyperLynx High-Speed Circuit Design and Simulation (IX) Research on Single-Line Differential Line of Four-Layer Board Stacking Structure
# HyperLynx High-speed Circuit Design and Simulation (IX) Exploration of Single-line Differential Line of Four-layer Board Stacking Structure##1. Four-layer Board Stacking Structure###For the commonly...
bqgup Creative Market
Mid-Autumn Moon
The weather was very good at night, and the moon was big and round. I found my bird-watching tool and took a few photos to share with those who can't see the moon....
dcexpert Talking
My opinion on the current status of the CORTEX nuclear power plant
[b] My opinion on the current status of CORTEX core When ARM launched the CORTEX core, Luminary was the first to apply it to chips, but it did not do a good job in product promotion and its performanc...
ddllxxrr MCU
【Design Tools】Simplify the debugging process of Xilinx and Altera FPGA
Introduction As design size and design complexity continue to grow, verification and validation of field programmable gate array (FPGA) based system designs become a critical part of the process. Limi...
GONGHCU FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1507  1632  2351  1425  489  31  33  48  29  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号