Z8030DI datasheet, PDF - EEWORLD Datasheet

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Z8030DI: DescriptionSerial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size73KB，2 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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Z8030DI Overview

Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, CERAMIC, DIP-40

Z8030DI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	unknow
Address bus width	8
boundary scan	NO
Bus compatibility	8086; Z8000
maximum clock frequency	4 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC
Data encoding/decoding methods	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate	0.125 MBps
External data bus width	8
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
length	52.324 mm
low power mode	NO
Number of DMA channels
Number of I/O lines
Number of serial I/Os	2
Number of terminals	40
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	5.715 mm
Maximum slew rate	250 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	MOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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Z8030DI Related Products

	Z8030DI	Z8530DI
Description	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, CERAMIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, CERAMIC, DIP-40
Is it Rohs certified?	incompatible	incompatible
Maker	AMD	AMD
Parts packaging code	DIP	DIP
package instruction	DIP, DIP40,.6	DIP, DIP40,.6
Contacts	40	40
Reach Compliance Code	unknow	unknow
boundary scan	NO	NO
Bus compatibility	8086; Z8000	8080; Z80; 6800; 68000; MULTIBUS
maximum clock frequency	4 MHz	4 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC
Data encoding/decoding methods	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate	0.125 MBps	0.125 MBps
External data bus width	8	8
JESD-30 code	R-GDIP-T40	R-GDIP-T40
JESD-609 code	e0	e0
length	52.324 mm	52.324 mm
low power mode	NO	NO
Number of serial I/Os	2	2
Number of terminals	40	40
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm
Maximum slew rate	250 mA	250 mA
Maximum supply voltage	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	MOS	MOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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