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ZL50418/GKC

Description
DATACOM, LAN SWITCHING CIRCUIT, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,155 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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ZL50418/GKC Overview

DATACOM, LAN SWITCHING CIRCUIT, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553

ZL50418/GKC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeBGA
package instructionHBGA, BGA553,29X29,50
Contacts553
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B553
JESD-609 codee0
length37.5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals553
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Encapsulate equivalent codeBGA553,29X29,50
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)225
power supply2.5,3.3 V
Certification statusNot Qualified
Maximum seat height2.46 mm
Nominal supply voltage2.5 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width37.5 mm
ZL50418
Managed 16-Port 10/100M + 2-Port
10/100/1000M Layer-2 Ethernet Switch
Data Sheet
Features
Integrated Single-Chip 10/100/1000M Ethernet
Switch
• Sixteen 10/100 Mbps auto-negotiating Fast Ethernet
(FE) ports with RMII or GPSI (7WS) interface
options per port
• Two 10/100/1000M auto-negotiating Gigabit
Ethernet (GE) ports with GMII, TBI, and MII
interface options per port
July 2006
Ordering Information
ZL50418/GKC
ZL50418GKG2
553 Pin HSBGA
553 Pin HSBGA**
**Pb Free Tin/Silver/Copper
-40°C to 85°C
High performance packet classification and
switching at full-wire speed
CPU access supports the following interface
options:
• 8/16-bit ISA interface in managed mode
• Serial interface in unmanaged mode, with optional
I
2
C EEPROM support
Operates stand-alone or can be cascaded
• Stacking port supports hot swap in managed
configuration
Supports two Frame Data Buffer (FDB) memory
domains
(2 MB or 4 MB)
with pipelined, sync-burst
SRAM at 100 MHz
• Applies centralized shared memory architecture
L2 Switching
• MAC address self learning, up to 64K MAC
addresses
• Supports port-based and tagged-based VLAN (IEEE
802.1Q)
• Supports up to 255 VLANs and IP multicast groups
• VLAN tag insertion and stripping selectable on a per
port, per VLAN basis
• Supports spanning tree on per-system (IEEE
802.1D/w) or per-VLAN basis (IEEE 802.1s)
Packet Filtering and Port Security
• Static address filtering for source and/or destination
MAC
• Static MAC address not subject to aging
• Secure mode freezes MAC address learning, each
port may independently use this mode
Supports IP Multicast with IGMP snooping
Supports Ethernet multicasting and broadcasting
and flooding control
Supports per-system option to enable flow
control for best effort frames even on QoS-
enabled ports
VLAN 1 MCT
Frame Data Buffer A
SRAM (1 M / 2 M)
VLAN 1 MCT
Frame Data Buffer B
SRAM (1 M / 2 M)
FDB Interface
LED
FCB
Frame Engine
Search
Engine
MCT
Link
16 x 10/100M
RMII
Ports 0 - 15
GMII/
PCS
Port
24
GMII/
PCS
Port
25
Management
Module
16-bit
Parallel /
Serial
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50418/GKC Related Products

ZL50418/GKC ZL50418GKG2
Description DATACOM, LAN SWITCHING CIRCUIT, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553 DATACOM, LAN SWITCHING CIRCUIT, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553
Is it lead-free? Contains lead Lead free
Is it Rohs certified? incompatible conform to
Maker Microsemi Microsemi
Parts packaging code BGA BGA
package instruction HBGA, BGA553,29X29,50 HBGA,
Contacts 553 553
Reach Compliance Code compliant compliant
JESD-30 code S-PBGA-B553 S-PBGA-B553
JESD-609 code e0 e1
length 37.5 mm 37.5 mm
Number of functions 1 1
Number of terminals 553 553
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HBGA HBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 225 NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum seat height 2.46 mm 2.46 mm
Nominal supply voltage 2.5 V 2.5 V
surface mount YES YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED
width 37.5 mm 37.5 mm

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