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5962F0822801VXC

Description
Microprocessor, 32-Bit, 66MHz, CMOS, CQFP352, HERMETIC SEALED, CERAMIC PACKAGE-352
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size368KB,40 Pages
ManufacturerCobham Semiconductor Solutions
Download Datasheet Parametric Compare View All

5962F0822801VXC Overview

Microprocessor, 32-Bit, 66MHz, CMOS, CQFP352, HERMETIC SEALED, CERAMIC PACKAGE-352

5962F0822801VXC Parametric

Parameter NameAttribute value
MakerCobham Semiconductor Solutions
Parts packaging codeQFP
package instructionQFF,
Contacts352
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeS-CQFP-F352
JESD-609 codee4
length48 mm
low power modeYES
Number of terminals352
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Package shapeSQUARE
Package formFLATPACK
Certification statusNot Qualified
Filter levelMIL-PRF-38535 Class V
Maximum seat height3.54 mm
speed66 MHz
Maximum supply voltage2.7 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD OVER NICKEL
Terminal formFLAT
Terminal pitch0.5 mm
Terminal locationQUAD
total dose300k Rad(Si) V
width48 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
Standard Products
UT699 32-bit Fault-Tolerant
SPARC
TM
V8/LEON 3FT Processor
Data Sheet
June 25, 2012
FEATURES
Implemented on a 0.25mCMOS technology
Flexible static design allows up to 66MHz clock rate
89 DMIPS throughput via 66MHz base clock frequency
Internally configured clock network
On-board programmable timers and interrupt controllers
High-performance fully pipelined IEEE-754 FPU
Power saving 2.5V core power supply
3.3V I/O compatibility
Hardened-by-design flip-flops and memory cells
Separate instruction and data cache architecture
10/100 Base-T Ethernet port for VxWorks development
Integrated PCI 2.2 compatible core
Four integrated multi-protocol SpaceWire nodes with two
supporting the RMAP protocol
Two CAN-compliant 2.0 bus interfaces
Multifunctional memory controller
-40
o
C to +105
o
C operating case temperature range
Operational environment:
- Intrinsic total-dose: 100 krad(Si) and 300 krad(Si)
- SEL Immune >108 MeV-cm
2
/mg
Packaging options:
- 352-pin Ceramic Quad Flatpack, weight 31.5 grams
- 484-pin Ceramic Land Grid, Column Grid and Ball
Grid Array packages
Standard Microcircuit Drawing 5962-08228
- QML Q and V
Applications
- Nuclear power plant controls
- Critical transportation systems
- High-altitude avionics
- Medical electronics
- X-Ray cargo scanning
INTRODUCTION
The UT699 is a pipelined monolithic, high-performance, fault-
tolerant SPARC
TM
V8/LEON 3FT Processor. The UT699
provides a 32-bit master/target PCI interface, including a 16 bit
user I/O interface for off-chip peripherals. A compliant 2.0
AMBA bus interface integrates the on-chip LEON 3FT,
SpaceWire, Ethernet, memory controller, cPCI, CAN bus, and
programmable interrupt peripherals.
The UT699 is SPARC V8 compliant; compilers and kernels for
SPARC V8 can therefore be used industry standard
development tools. A full software development suite is
available including a C/C++ cross-compiler system based on
GCC and the Newlib embedded C-library.
BCC includes a small run-time kernel with interrupt support
and Pthreads library. For multi-threaded applications, a
SPARC
TM
compliant port of the eCos real-time kernel, RTEMS
4.6.5, and VxWorks 6.x is supported.
1

5962F0822801VXC Related Products

5962F0822801VXC 5962F0822801QXC
Description Microprocessor, 32-Bit, 66MHz, CMOS, CQFP352, HERMETIC SEALED, CERAMIC PACKAGE-352 Microprocessor, 32-Bit, 66MHz, CMOS, CQFP352, CERAMIC, TOP BRAZED, QFP-352
Maker Cobham Semiconductor Solutions Cobham Semiconductor Solutions
Parts packaging code QFP QFP
package instruction QFF, GQFF,
Contacts 352 352
Reach Compliance Code unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C
Address bus width 32 28
bit size 32 32
boundary scan YES YES
maximum clock frequency 66 MHz 66 MHz
External data bus width 32 32
Format FIXED POINT FLOATING POINT
Integrated cache NO YES
JESD-30 code S-CQFP-F352 S-CQFP-F352
JESD-609 code e4 e4
length 48 mm 48 mm
low power mode YES NO
Number of terminals 352 352
Maximum operating temperature 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFF GQFF
Package shape SQUARE SQUARE
Package form FLATPACK FLATPACK, GUARD RING
Certification status Not Qualified Not Qualified
Filter level MIL-PRF-38535 Class V MIL-PRF-38535 Class Q
Maximum seat height 3.54 mm 5.05 mm
speed 66 MHz 66 MHz
Maximum supply voltage 2.7 V 2.7 V
Minimum supply voltage 2.3 V 2.3 V
Nominal supply voltage 2.5 V 2.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface GOLD OVER NICKEL GOLD
Terminal form FLAT FLAT
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
total dose 300k Rad(Si) V 300k Rad(Si) V
width 48 mm 48 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR
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