GM71C256A-10 datasheet, PDF - EEWORLD Datasheet

GM71C256A-10: DescriptionFast Page DRAM, 256KX1, 100ns, CMOS, PDIP16,; Categorystorage storage; File Size756KB，19 Pages; ManufacturerLG Semicon Co., Ltd.

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GM71C256A-10 Overview

Fast Page DRAM, 256KX1, 100ns, CMOS, PDIP16,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LG Semicon Co., Ltd.
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	FAST PAGE DRAM
memory width	1
Number of terminals	16
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Maximum slew rate	0.05 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	GM71C256A-10	GM71C256A-80	GM71C256A-70
Description	Fast Page DRAM, 256KX1, 100ns, CMOS, PDIP16,	Fast Page DRAM, 256KX1, 80ns, CMOS, PDIP16,	Fast Page DRAM, 256KX1, 70ns, CMOS, PDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.
Reach Compliance Code	unknown	unknown	unknow
Maximum access time	100 ns	80 ns	70 ns
I/O type	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0
memory density	262144 bit	262144 bit	262144 bi
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	1	1	1
Number of terminals	16	16	16
word count	262144 words	262144 words	262144 words
character code	256000	256000	256000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	256KX1	256KX1	256KX1
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	256	256	256
Maximum slew rate	0.05 mA	0.06 mA	0.07 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL

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