FIFO, 64X4, Asynchronous, MOS, CDIP16,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 0.75 MHz |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Humidity sensitivity level | 2A |
| Number of terminals | 16 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
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