NAND Gate Based Peripheral Driver, 2 Driver, BIPolar, DIP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Number of drives | 2 |
| Interface integrated circuit type | NAND GATE BASED PERIPHERAL DRIVER |
| JESD-30 code | R-XDIP-T8 |
| JESD-609 code | e0 |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output current flow direction | SOURCE AND SINK |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Disconnect time | 0.035 µs |
| connection time | 0.035 µs |

| 55452BRMQB | 55450BDMQB | 55452BRM | 75452BTC | |
|---|---|---|---|---|
| Description | NAND Gate Based Peripheral Driver, 2 Driver, BIPolar, DIP-8 | And Gate Based Peripheral Driver, 2 Driver, BIPolar, DIP-14 | Peripheral Driver, 2 Driver, BIPolar, CDIP8, | Peripheral Driver, 2 Driver, BIPolar, PDIP8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| Number of drives | 2 | 2 | 2 | 2 |
| JESD-30 code | R-XDIP-T8 | R-XDIP-T14 | R-XDIP-T8 | R-PDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 8 | 14 | 8 | 8 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - |
| Package body material | UNSPECIFIED | UNSPECIFIED | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP14,.3 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| package instruction | DIP, DIP8,.3 | DIP-14 | - | DIP, DIP8,.3 |
| ECCN code | EAR99 | EAR99 | - | EAR99 |