CYStech Electronics Corp.
1.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 1/6
SK12SA thru SK1BSA
Features
For surface mounted applications.
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
Low leakage current.
High surge capability.
High temperature soldering: 250C/10 seconds at terminals.
Exceeds environmental standards of MIL-S-19500/228.
Mechanical Data
Case: Molded plastic, JEDEC DO-214AC/SMA.
Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
Polarity: Indicated by cathode band.
Mounting position: Any.
Weight: 0.064 gram, 0.002 ounce.
Ordering Information
Device
SK12SA-0-T4-G
SK13SA-0-T4-G
SK14SA-0-T4-G
SK15SA-0-T4-G
SK16SA-0-T4-G
SK18SA-0-T4-G
SK1BSA-0-T4-G
Package
Shipping
Marking
SK12
SK13
SK14
SK15
SK16
SK18
SK1B
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 2/6
(Rating
at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
Voltage @ I
F
=1A
(Note 1)
Maximum average forward
rectified current @ T
L
=100°C
Peak forward surge current @
8.3ms, single half sine-wave
superimposed on rated load
(JEDEC method)
Maximum DC reverse current at
Rated DC blocking
TJ=25°C
voltage
TJ=100°C
Typical thermal resistance,
junction to lead
Typical thermal resistance,
junction to case
Power
T
A
=25°C
Dissipation
T
C
=25°C
Typical diode junction
capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
Operating temperature
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
SK12
20
14
20
SK13 SK14
30
40
21
28
30
40
0.5
Type
SK15
50
35
50
SK16 SK18
60
80
42
56
60
80
SK1B
100
70
100
0.85
Units
V
V
V
V
A
0.7
1
I
FSM
30
A
I
R
R
th, JA
R
th, JC
P
D
C
J
Tstg
T
J
0.5
10
85
18
1.5
7
120
-55 ~ +150
-55 ~ +125
mA
°C/W
°C/W
W
pF
°C
°C
Recommended soldering footprint
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 3/6
SK12-SK14
SK16
SK18-SK1B
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 4/6
Carrier Tape Dimension
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
C
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 5/6
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(T
S
min)
−Temperature Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature (T
L
)
− Time (t
L
)
Peak Temperature(T
P
)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25
C
to peak temperature
Sn-Pb eutectic Assembly
3C/second max.
100C
150C
60-120 seconds
183C
60-150 seconds
240 +0/-5
C
10-30 seconds
6C/second max.
6 minutes max.
Pb-free Assembly
3C/second max.
150C
200C
60-180 seconds
217C
60-150 seconds
260 +0/-5
C
20-40 seconds
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK12SA thru SK1BSA
CYStek Product Specification
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