H8/3867 Series
H8/3867
H8/3866
H8/3865
H8/3864
H8/3863
H8/3862
HD6473867, HD6433867
HD6433866
HD6433865
HD6433864
HD6433863
HD6433862
H8/3827 Series
H8/3827
H8/3826
H8/3825
H8/3824
H8/3823
H8/3822
HD6473827, HD6433827
HD6433826
HD6433825
HD6433824
HD6433823
HD6433822
Hardware Manual
ADE-602-142B
Rev. 3
4/15/99
Hitachi Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
List of Items Revised or Added for This Version
Page
1
2
3
5
8
13
88
89
91
92
95
97
99
100
102
104
107
Item
Table 1.1 Features / CPU
Table 1.1 Features / Clock pulse
generators
Table 1.1 Features / LCD drive power
supply
Figure 1.1 Block Diagram
Description
Change in (2) High-speed calculation
specification
Change in specification
Addition
Modification
Table 1.2 Pin Functions / Power source pin Modification of stabilization capacitance
2.1.1 Features
Figure 4.2 Typical Connection to Crystal
Oscillator
Figure 4.4 Typical Connection to Ceramic
Oscillator
Figure 4.7 Typical Connection to 32.768-
kHz/38.4 kHz Crystal Oscillator (Subclock)
Change in High-speed operation
Addition of recommended value
Addition of recommended value
Addition of description
Figure 4.9 Pin Connection when not Using Modification
Subclock
Table 5.1 Operating Modes
Modification of subsleep mode/watch mode
descriptions
Table 5.2 Internal State in Each Operating Modification of Note 4
Mode
5.1.1 System Control Registers
1. System control register 1 (SYSCR1)
2. System control register 2 (SYSCR2)
5.2 Sleep Mode
Addition of Notes to Bits 6 to 4
Modification of Bit 4 contents
Addition of description
5.3.3 Oscillator Settling Timer after Stanby Addition of description
Mode is Cleared
5.5.2 Clearing Subsleep Mode
•
Clearing by interrupt
Addition of description
109
147
226
248
251
5.7.1 Transition to Active (Medium-Speed) Addition of description
Mode
Table 8.10 Port 3 Pin States
Table 9.13 Timer G Operation Modes
9.7.5 Application Notes
Figure 10.1 SCI3 Block Diagram
Modification
Addition of description in Notes
Addition and modification of descriptions
Modification
Page
256
265
266
267
268
303
357
360 to
362
363 to
368
369 to
370
371
372
373
376
377
Item
Description
10.2.5 Serial Mode Register (SMR) / Bits 1 Addition of description in Notes
and 0
Table 10.4 Relation between n and Clock
Table 10.5 Maximum Bit Rate for Each
Frequency (Asynchronous Mode)
Table 10.7 Relation between n and Clock
10.2.9 Clock Stop Register 1 (CKSTPR1)
10.5 Application Notes
14.2 When Using the Internal Power
Supply Step-Down Circuit
15.2.1 Power Supply Voltage and
Operating Range
Table 15.2 DC Characteristics
Table 15.3 Control Signal Timing
Table 15.4 Serial Interface (SCI3-1,
SCI3-2) Timing
Table 15.5 A/D Converter Characteristics
Addition of description in Notes
Modification of Notes
Addition of description in Notes
Addition of description in Notes for Bits 6
and 5
Addition of 9 and 10.
Modification of description
Modification of 1 to 3
Addition and modification
Addition and modification
Addition of Notes
Modification
Table 15.7 AC Characteristics for External Addition
Segment Expansion
Figure 15.6 SCI-3 Synchronous Mode
Input/Output Timing
Figure 15.7 Segment Expansion Signal
Timing
Modification of Notes
Addition
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is
compatible with the H8/300 CPU.
The H8/3867 Series and H8/3827 Series have a system-on-a-chip architecture that includes such
peripheral functions as a as an LCD controller/driver, six timers, a 14-bit PWM, a two-channel
serial communication interface, and an A/D converter. This allows H8/3867 Series devices to be
used as embedded microcomputers in systems requiring LCD display.
The H8/3867 Series incorporates an LCD drive power supply and step-up constant power supply
(5 V), enabling a fixed 5 V voltage to be obtained independently of V
CC
.
This manual describes the hardware of the H8/3867 Series and H8/3827 Series. For details on the
H8/3864 Series instruction set, refer to the H8/300L Series Programming Manual.
i
Embedded System
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