M
ULTI
-L
AYER
H
IGH
-Q C
APACITORS
These lines of multilayer capacitors have been developed for
High-Q and microwave applications.
•
The
S-Series
(R03S, R07S, R14S, R15S) capacitors give an
ultra-high Q performance, and exhibit NP0 temperature char-
acteristics.
•
The
L-Series
(R05L) capacitors give mid-high Q performance,
and exhibit NP0 temperature characteristics.
•
The
E-Series
(S42E, S48E, S58E) capacitors give excellent
high-Q performance from HF to Microwave frequencies.
Typical uses are high voltage, high current applications. They
are offered in chip (Ni barrier or Non-Magnetic Pt.-Ag) or in
Non-Magnetic leaded form.
•
The
W-Series
(R05W) capacitors offer a large capacitance
value in an ultra-small 0201 package size. These exhibit a X7R
temperature characteristic.
•
RoHS compliance is standard for all unleaded parts (see
termination options box).
H
OW TO
O
RDER
252
VOLTAGE
6.3 = 6R3 V
160 = 16 V
250 = 25 V
500 = 50 V
251 = 250 V
501 = 500 V
102 = 1000 V
152 = 1500 V
202 = 2000 V
252 = 2500 V
362 = 3600 V
S48
CASE SIZE
R03 (01005)
R05 (0201)
R07 (0402)
R14 (0603)
R15 (0805)
S42 (1111)
S48 (2525)
S58 (3838)
E
470
CAPACITANCE
1st two digits are
significant; third digit
denotes number of
zeros, R = decimal.
100 = 10 pF
101 = 100 pF
K
TOLERANCE
** A = +/- 0.05 pF
* B = ± 0.10 pF
* C = ± 0.25 pF
* D = ± 0.50 pF
F = ±1 %
G = ±2%
J = ±5%
K = +/- 10%
For tolerance
availability, see chart.
Y
TERMINATION
Nickel Barrier Types
G = Ni/Au
T = Ni/Sn-Pb
V = Ni / 100% Sn
Non Magnetic Types
Y = Non-Leaded
Pt-Ag
1 = Microstrip Ribbon
Leads
(E-Series Only)
2 = Axial Ribbon
Leads
(E-Series Only)
4
MARKING
3 = Cap Code
& Tolerance
4 = No Marking
6 = EIA Code
(Marking on
0805 and
larger only)
E
DIELECTRIC
E
= NPO, High Q,
High Power
L
= NPO
S
= S Dielectric
W
= X7R
PACKAGING
S = Bulk
W = Waffle Pack
01005 - 0603
Y = Paper 5” Reel
T = Paper 7” Reel
Part Number written:
252S48E470KY4E
0805 - 3838
Z = Embossed 5” Reel
E = Embossed 7” Reel
U = Embossed 13” Reel
Tape specifications
conform to EIA RS481
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7
D
IELECTRIC
C
HARACTERISTICS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR / DF:
INSULATION RESISTANCE:
NPO
0 ± 30ppm /°C, -55 to 125°C
Q
>1,000 @ 1 MHz, Typical 10,000
X7R
± 15%, -55 to 125°C
16VDC DF
≤
3.5% @ 1 KHz, 25°C
10VDC DF
≤
5.0% @ 1 KHz, 25°C
>10 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
>500
ΩF*
or 10 GΩ* @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
* whichever is less
2.5 X WVDC Min., 25°C, 50 mA max
1KHz ±50Hz, 1.0±0.2 VRMS, 25°C
100 - 10,000 pF
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
Size 01005:
Size 0201:
Size 0402:
Size 0603:
Size 0805:
Size 1111:
Size 2525:
Size 3838:
0.2 - 10 pF
0.2 - 100 pF
0.2 - 33 pF
0.2 - 100 pF
0.3 - 220 pF
0.1 - 1000 pF
1.0 - 2700 pF
1.0 - 5100 pF
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO
SOLDERING HEAT:
Solder coverage
≥
90% of metalized areas
No termination degradation
No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
No mechanical damage
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R.
≥
1 G-Ohm
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R.
≥
10 G-Ohm
Breakdown voltage: 2.5 x WVDC
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260°±5°C solder for 10±1 sec.
Measure after 24±2 hour cooling period
Linear pull force* exerted on axial leads soldered to each terminal.
*0402
≥
2.0lbs, 0603
≥
2.0lbs (min.)
Glass epoxy PCB: 0.5 mm deflection
Applied voltage: 200% rated voltage, 50 mA max.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2% Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL CYCLE:
HUMIDITY,
STEADY STATE:
HUMIDITY,
LOW VOLTAGE:
VIBRATION:
10
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M
ECHANICAL
C
HARACTERISTICS
Size
Units
In
mm
In
mm
In
mm
In
mm
In
mm
Length
Width
Thickness
End Band
01005
(0402)
0201
(0603)
0402
(1005)
0603
(1608)
0805
(2012)
.016 ±.001
.024 ±.001
.040 ±.004
(1.02 ±0.1)
.062 ±.006
.080 ±.008
.008 ±.001
.012 ±.001
.020 ±.004
(0.51 ±0.1)
.008 ±.001
(0.20 ±0.03)
.012 ±.001
(0.30 ±0.03)
.020 ±.004
(0.51 ±0.1)
(0.76 +.13-.08)
.040 ±.006
(1.02 ±.15)
.006 Max.
(0.15 Max.)
.008 Max.
(0.20 Max.)
.010 ±.006
(0.25 ±.15)
.014 ±.006
(0.35 ±.15)
.020 ±.010
(0.50 ±.25)
(0.40 ±0.03) (0.20 ±0.03)
(0.60 ±0.03) (0.30 ±0.03)
.032 ±.006 .030 +.005/-.003
.050 ±.008
(1.57 ±0.15) (0.81 ±0.15)
(2.03 ±0.20) (1.27 ±0.20)
E-S
ERIES
L
EAD
S
TYLE
S
ELECTION
Unleaded Terminations Code “Y” (Pt.-Ag),
“V” (Ni / 100% Sn), or “T” (Ni / SnPb)
Microstrip Ribbon Leads (Non-Magnetic),
Termination Code “1”
e
W
Axial Ribbon Leads (Non-Magnetic),
Termination Code “2”
e
T
L
T
E/B
X
T
W
X
W
LL
L
LL
LL
L
LL
Lead
Size
S42E
Y, V,
S48E
T
S58E
Lead
Size
Units
L
Tol
W
Tol
0.110 +.020 -.010 0.110 +/- .020
In
mm
2.79 +0.51 -0.25 2.79 +/- 0.51
0.230 +.025 -.010 0.250 +/- .015
In
mm
5.84 +0.63 -0.25 6.35 +/- 0.38
0.380 +.015 -.010 0.380 +/- .010
In
mm
9.65 +0.38 -0.25 9.65 +/- 0.25
T
0.102 Max.
2.59 Max.
0.150 Max.
3.81 Max.
0.170 Max.
4.32 Max.
E/B
0.015 Typ.
0.38 Typ.
0.025 Typ.
0.63 Typ.
0.025 Typ.
0.63 Typ.
For all E-Series Models:
OPERATING TEMP. :
INSULATION RESISTANCE:
TEMPERATURE COEFFICIENT:
DISSAPATION FACTOR (TYP.):
-55 to +125°C
>1000
ΩF
or 100 GΩ,
whichever is less @ 25°C WVDC
0 ± 30ppm /°C, -55 to 125°C
< 0.05% @ 1 MHz
S42E
1
S48E
S58E
S42E
2
S48E
S58E
Units
In
mm
In
mm
In
mm
In
mm
In
mm
In
mm
L
Tol
W
0.110
2.79
0.250
6.35
0.38
9.65
0.110
2.79
0.250
6.35
0.38
9.65
Tol
+/- .020
+/- 0.51
+/- 0.015
+/-0.38
+/- 0.010
+/- 0.25
+/- .020
+/- 0.51
+/- 0.015
+/-0.38
+/- 0.010
+/- 0.25
T (max)
0.120
3.05
0.160
3.81
0.170
4.32
0.102
2.59
0.160
3.81
0.170
4.32
E/B (typ) LL(min)
0.015
0.38
0.025
0.63
0.04 MAX.
1.02 MAX.
0.015
0.38
0.025
0.63
0.04 MAX.
1.02 MAX.
0.25
6.35
0.50
12.7
0.750
19.05
0.25
6.35
0.50
12.7
0.750
19.05
X
0.093
2.36
0.240
6.10
0.35
8.89
0.093
2.36
0.240
6.10
0.35
8.89
Tol
+/-0.005
+/- 0.13
+/- 0.005
+/- 0.13
+/- 0.010
+/- 0.25
+/-0.005
+/- 0.13
+/- 0.005
+/- 0.13
+/- 0.010
+/- 0.25
e
0.004
0.102
0.004
0.102
0.010
0.25
0.004
0.102
0.004
0.102
0.010
0.25
Tol
+/- 0.001
+/- 0.025
+/- 0.001
+/- 0.025
+/- 0.005
+/- 0.13
+/- 0.001
+/- 0.025
+/- 0.001
+/- 0.025
+/- 0.005
+/- 0.13
0.135
+/- .015
3.43
+/- 0.38
0.245
+/- 0.025
6.22
+/- 0.64
0.38 +0.035 / - 0.010
9.65
+0.89 / -0.25
0.135
+/- .015
3.43
+/- 0.38
0.245
+/- 0.025
6.22
+/- 0.64
0.38 +0.035 / - 0.010
9.65
+0.89 / -0.25
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PCB Design
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