EEWORLDEEWORLDEEWORLD

Part Number

Search

30HS24N391ZC

Description
Ceramic Capacitor, Multilayer, Ceramic, 3000V, 80% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00039uF, Through Hole Mount, RADIAL LEADED
CategoryPassive components    capacitor   
File Size79KB,5 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

30HS24N391ZC Overview

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 80% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00039uF, Through Hole Mount, RADIAL LEADED

30HS24N391ZC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerKEMET
package instruction,
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.00039 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee0
Manufacturer's serial numberHS
Installation featuresTHROUGH HOLE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
positive tolerance80%
Rated (DC) voltage (URdc)3000 V
surface mountNO
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeWIRE
High Voltage
Space Quality MLC (-55° to +125°C)
HS Series
FEATURES
1. Conforms to MIL-PRF-49467. (Group A Screening,
Subgroup 1)
2. 100% Corona tested.
3. No IR degradation over life.
4. High density, low DF ceramic.
5. Conservative and proven design is recommended for
non-repairable applications such as spacecraft.
6. CSAM inspection is available and is recommended for
space applications.
7. Burn-in in a non-contaminating inert fluid is standard for
>2KV; optional for 500V or 1 KV parts.
CAPACITOR OUTLINE DRAWING
L
T
W
1.25
Min.
S
.025 (22 ga.) solder plated
Cu-clad Steel (CCFE)
DIMENSIONS
Style
HS20
HS21
HS22
HS30
HS23
HS31
HS24
HS25
HS26
HS33
HS34
HS35
HS36
Sizes in Inches (mm) max.
Length (L)
.250 (6.35)
.320 (8.13)
.370 (9.40)
.450 (11.43)
.470 (11.94)
.550 (13.97)
.570 (14.48)
.670 (17.02)
.770 (19.56)
.850 (21.59)
1.050 (26.67)
1.250 (31.75)
1.450 (36.83)
Width (W)
.220 (5.59)
.280 (7.11)
.300 (7.62)
.220 (5.59)
.400 (10.16)
.280 (7.11)
.500 (12.70)
.600 (15.24)
.720 (18.29)
.400 (10.16)
.500 (12.70)
.600 (15.24)
.720 (18.29)
Thickness (T)
.200 (5.08)
.250 (6.35)
.250 (6.35)
.200 (5.08)
.270 (6.89)
.250 (6.35)
.270 (6.89)
.270 (6.89)
.270 (6.89)
.270 (6.89)
.270 (6.89)
.270 (6.89)
.270 (6.89)
Lead Spacing
±0.030 (S)
.170 (4.32)
.220 (5.59)
.275 (6.98)
.300 (7.62)
.375 (9.52)
.400 (10.16)
.475 (12.06)
.575 (14.60)
.675 (17.14)
.700 (17.78)
.975 (24.76)
1.175 (29.84)
1.375 (34.92)
PART NUMBER AND ORDERING INFORMATION
10
VOLTAGE
05 = 500V
10 = 1000V
20 = 2000V
30 = 3000V
STYLE
HS24, etc.
DIELECTRIC
B = X7R
N = BP C0G (NP0)
CAPACITANCE VALUE
First two digits are significant,
last digit is number of zeros,
i.e., 103=10000pF
40 = 4000V
50 = 5000V
75 = 7500V
100 = 10,000V
HS24
B
103
K
C
F
INERT LIQUID (BURN-IN)
Std. for >2kV;
Add “F” if required
for 500V or 1kV parts
C=CSAM
MARKING
(HS20, HV21)
(All Other Sizes)
103K
HS24B103K
1 kV
1 kV
KEC
KEC
Date Code
Date Code
TOLERANCE
J = ±5%
K = ±10%
M = ±20%
P = 0/+100%
Z = -20%/+80%
34
© KEMET Electronics Corporation • PO Box 5928 • Greenville, SC 29606 • www.kemet.com
Baseband and RF design in mobile phones
Abstract GSM is currently the most widely adopted digital cellular telephony standard in the world. This paper presents details of the design of the RF to baseband section of a PCS1900 cellular handse...
qin552011373 ADI Reference Circuit
About Windows DDK problem, urgent!
After I installed Windows DDK for Windows 2000, Windows XP, and Windows Server 2003, I got a lot of installation error messages. When I opened Windows XP checked Build Environments, the following erro...
liuxing200 Embedded System
The Principle and Application of RS232/TTL Level Converter Chip MAX232
The Principle and Application of RS232/TTL Level Converter Chip MAX232...
zzzzer16 FPGA/CPLD
How to write USB camera driver in Win CE 5.0 environment
I would like to ask an expert to teach me whether I can use VS2005 to write a USB camera driver for Win CE5.0. The application can use this driver to capture images and transmit them over the network....
hulicong Embedded System
It turns out that this world is really small...
A few days ago, I saw [url=https://home.eeworld.com.cn/my/space.php?uid=144855][color=#0000ff]zqzq501311[/color][/url] said in soso’s post that the cost of living in Nanjing is too high, so I sent him...
open82977352 Talking
Seeking cooperation with Daxia in set-top box development
http://topic.eeworld.net/u/20071201/18/a2aaf09f-7fa2-419c-93c1-77b51f9713d8.html?seed=1107526537...
excellence Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 176  761  1012  946  2094  4  16  21  20  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号