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R71VW5150500K

Description
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 520 V, 15 uF, THROUGH HOLE MOUNT, RADIAL LEADED
CategoryPassive components    capacitor   
File Size425KB,5 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

R71VW5150500K Overview

CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 520 V, 15 uF, THROUGH HOLE MOUNT, RADIAL LEADED

R71VW5150500K Parametric

Parameter NameAttribute value
MakerKEMET
package instruction,
Reach Compliance Codecompliant
Other featuresRATED AC VOLTAGE (V): 250
capacitance15 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
JESD-609 codee3
Manufacturer's serial numberMKP
Installation featuresTHROUGH HOLE MOUNT
negative tolerance10%
Maximum operating temperature110 °C
Minimum operating temperature-40 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)520 V
surface mountNO
Terminal surfaceTIN
Terminal shapeWIRE
Loose
Fig.1
Taped
Fig.2
Typical applications:
P.F.C. (Power Factor Correction)
PRoDUCT CoDe:
R71
MeTAllIZeD POlyPROPylene FIlM
CAPACITOR
MKP series
R71
Ø d ±0.05
p
≤15
0.6 or 0.8*
22.5
p
27.5
0.8
p = 37.5
1
*see size table.
All dimensions are in mm.
MKP Series
geneRAl TeCHnICAl DATA
Dielectric:
polypropylene film.
Plates:
metal layer deposited by evaporation under
vacuum.
Winding:
non-inductive type.
leads:
tinned wire.
Protection:
plastic case, thermosetting resin filled.
Box material is solvent resistant and flame
retardant according to UL94 V0.
Marking:
Manufacturer’s logo, series, capacitance,
tolerance, D.C. rated voltage.
Operating temperature range:
-40 to +110°C
For temperatures between +105°C and 110°C a
decreasing factor of 4% per degree C on the rated
voltage V
R
has to be applied.
eleCTRICAl CHARACTeRISTICS
Capacitance range:
0.01µF to 22µF
Capacitance tolerances
(measured at 1 kHz):
±5% (J) ±10% (K); ±20% (M);
Tolerance available upon requests
Total self-inductance
(L): (lead length ~2mm)
Pitch (mm)
L(nH)
10
9
15
10
22.5
18
27.5
18
37.5
20
Pitch Box thickness (B)
(mm)
(mm)
10.0
All
15.0
<7.5
15.0
≥7.5
22.5
All
27.5
All
37.5
All
Maximum dimensions (mm)
B max
H max
L max
B +0.2
H +0.1
L +0.2
B +0.2
H +0.1
L +0.3
B +0.2
H +0.1
L +0.5
B +0.2
H +0.1
L +0.3
B +0.2
H +0.1
L +0.3
B +0.3
H +0.1
L +0.3
TeST MeTHOD AnD PeRFORMAnCe
Damp heat, steady state:
Test conditions 1st
Temperature:
Relative humidity (RH):
Test duration:
Test conditions 2nd
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|:
Insulation resistance:
endurance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|:
Insulation resistance:
Resistance to soldering heat:
Test conditions
solder bath temperature:
Dipping time (with heat screen):
Performance
Capacitance change |∆C/C|:
≤2%
+260°C±5°C
10 s±1 s
+105°C±2°C
2000 h
1.25xV
R
≤5%
≥50%
of initial limit.
≤5%
≥50%
of initial limit.
+60°C±2°C
95% ±2%
500 hours
+40°C±2°C
93% ±2%
56 days
Dissipation factor (DF):
tgδx10
-4
at +25°C ±5°C:
≤10
(6)* at 1kHz
*
Typical value
Insulation resistance:
Test conditions
Temperature:
+25°C±5°C
Voltage charge time:
1 min
Voltage charge:
100 Vdc
Performance
≥1
x 10
5
MΩ for C
≤0.33
µ
F
(5 x 10
5
MΩ)*
≥30000
s
for C
>0.33
µ
F
(150000 s)*
*Typical
value
Test voltage between terminations:
1.6xV
R
applied for 2 s at +25°C±5°C
Winding scheme
09/2008
74
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