LESHAN RADIO COMPANY, LTD.
Inverting Buffer / CMOS Logic Level Shifter
with LSTTL–Compatible Inputs
L74VHC1GT04
The
L74VHC1GT04
is a single gate inverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation
similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output.
The device input is compatible with TTL–type input thresholds and the output has a full 5 V CMOS level output swing. The input
protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from
3.0 V CMOS logic to 5.0V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high–voltage power supply.
The
L74VHC1GT04
input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This
allows the
L74VHC1GT04
to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when
V
CC
= 0 V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch,
battery backup, hot insertion, etc.
• High Speed: t
PD
= 3.8 ns (Typ) at V
CC
= 5 V
• Low Power Dissipation: I
CC
= 2 mA (Max) at T
A
= 25°C
• TTL–Compatible Inputs: V
IL
= 0.8 V; V
IH
= 2.0 V
• CMOS–Compatible Outputs: V
OH
> 0.8 V
CC
;
V
OL
< 0.1 V
CC
@Load
• Power Down Protection Provided on Inputs and Outputs
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic
Families
• Chip Complexity: FETs = 105; Equivalent Gates = 26
PIN ASSIGNMENT
MARKING DIAGRAMS
5
4
1
2
3
VK
d
SC–70/SC–88A/SOT–353
DF SUFFIX
Pin 1
d = Date Code
5
4
Figure 1. Pinout
(Top View)
1
2
3
VK
d
Figure 2. Logic Symbol
Pin 1
d = Date Code
SOT–23/TSOP–5/SC–59
DT SUFFIX
PIN ASSIGNMENT
1
2
3
4
5
NC
IN A
GND
OUT Y
V
CC
FUNCTION TABLE
Inputs
A
L
H
Output
Y
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 5 of this data sheet.
1/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT04
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
P
D
θ
JA
T
L
T
J
T
stg
V
ESD
Parameter
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Value
– 0.5 to + 7.0
– 0.5 to 7.0
– 0.5 to 7.0
–0.5 to V
cc
+ 0.5
–20
+20
+ 25
+50
200
333
260
+ 150
–65 to +150
>2000
> 200
N/A
± 500
Unit
V
V
V
mA
mA
mA
mA
mW
°C/W
°C
°C
°C
V
V
CC
=0
High or Low State
I
LATCH–UP
Input Diode Current
Output Diode Current
V
OUT
< GND; V
OUT
> V
CC
DC Output Current, per Pin
DC Supply Current, V
CC
and GND
Power dissipation in still air
SC–88A, TSOP–5
Thermal resistance
SC–88A, TSOP–5
Lead Temperature, 1 mm from Case for 10 s
Junction Temperature Under Bias
Storage temperature
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latch–Up Performance Above V
CC
and Below GND at 125°C (Note 5)
mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied. Functional operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
DC Supply Voltage
V
CC
V
IN
V
OUT
T
A
t
r
,t
f
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 3.3 ± 0.3 V
V
CC
= 5.0 ± 0.5 V
NORMALIZED FAILURE RATE
V
CC
= 0
High Low State
Min
3.0
0.0
0.0
0.0
– 55
0
0
Max
5.5
5.5
5.5
V
CC
+ 125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time,
Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time,
Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
2/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT04
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
Parameter
Minimum High–Level
Input Voltage
Test Conditions
V
CC
(V)
3.0
4.5
5.5
V
IL
Maximum Low–Level
Input Voltage
3.0
4.5
5.5
V
OH
Minimum High–Level
Output Voltage
V
IN
= V
IH
or V
IL
V
IN
= V
IH
or V
IL
I
OH
= –4 mA
I
OH
= –8 mA
V
OL
Maximum Low–Level
Output Voltage
V
IN
= V
IH
or V
IL
V
IN
= V
IH
or V
IL
I
OL
= 4 mA
I
OL
= 8 mA
I
IN
I
CC
I
CCT
I
OPD
Maximum Input
Leakage Current
Maximum Quiescent
Supply Current
Quiescent Supply
Current
Output Leakage
Current
V
IN
= 5.5 V or GND
V
IN
= V
CC
or GND
Input: V
IN
= 3.4 V
V
OUT
= 5.5 V
3.0
4.5
0 to5.5
5.5
5.5
0.0
0.36
0.36
±
0.1
2.0
1.35
0.5
0.44
0.44
±
1.0
20
1.50
5.0
0.52
0.52
±
1.0
40
1.65
10
V
IN
= V
IH
or V
IL
I
OL
= 50
µA
3.0
4.5
3.0
4.5
2.58
3.94
0.0
0.0
0.1
0.1
2.48
3.80
0.1
0.1
2.34
3.66
V
0.1
0.1
V
IN
= V
IH
or V
IL
I
OH
= – 50
µA
3.0
4.5
2.9
4.4
3.0
4.5
T
A
= 25°C
T
A
<
85°C
–55°C<T
A
<125°C
Min Typ Max Min Max Min Max Unit
V
1.4
1.4
1.4
2.0
2.0
0.53
0.8
0.8
2.9
4.4
2.0
2.0
0.53
0.8
0.8
2.9
4.4
2.0
2.0
V
0.53
0.8
0.8
V
µA
µA
mA
µA
AC ELECTRICAL CHARACTERISTICS
C
load
= 50 pF, Input t
r
= t
f
= 3.0 ns
T
A
= 25°C
Symbol
t
PLH
,
t
PHL
Parameter
Maximum
Propagation Delay,
Input A or B to Y
V
CC
= 5.0
±
0.5 V C
L
= 15 pF
C
L
= 50 pF
C
IN
Maximum Input
Capacitance
Typical @ 25°C, V
C
PD
Power Dissipation Capacitance (Note 6)
10
3.8
4.2
5
6.7
7.7
10
Test Conditions
V
CC
= 3.3
±
0.3 V C
L
= 15 pF
C
L
= 50 pF
Min
Typ
5.0
6.2
Max
10.0
13.5
T
A
<
85°C
–55°C<T
A
<125°C
Min
Max
11.0
15.0
7.5
8.5
10
CC
Min
Max Unit
13.0
17.5
8.5
9.5
10
pF
ns
= 5.0 V
pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without
load. Average operating current can be obtained by the equation: I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
.
C
PD
is used to determine the no–
load dynamic power consumption; P
D
= C
PD
•
V
CC 2
•
f
in
+ I
CC
•
V
CC
.
3/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT04
3.0V
V
OH
V
OL
Figure 4. Switching Waveforms
*Includes all probe and jig capacitance
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device
Order Number
Temp
Circuit
Range Technology Device
Indicator
Function
Identifier
L
L
L
L
L
74
74
74
74
74
VHC1G
VHC1G
VHC1G
VHC1G
VHC1G
T04
T04
T04
T04
T04
Package
Suffix
DF
DF
DF
DT
DT
Tape &
Reel
Suffix
T1
T2
T4
T1
T3
Package Type
(Name/SOT#/
Common Name)
SC–70/SC–88A/
SOT–353
SC–70/SC–88A/
SOT–353
SC–70/SC–88A/
SOT–353
SOT–23/TSOPS/
SC–59
SOT–23/TSOPS/
SC–59
Tape and
Reel Size
L74VHC1GT04DFT1
L74VHC1GT04DFT2
L74VHC1GT04DFT4
L74VHC1GT04DTT1
L74VHC1GT04DTT3
178
mm (7 in)
3000 Unit
178
mm (7 in)
3000 Unit
330
mm (13 in)
10,000 Unit
178
mm (7 in)
3000 Unit
330
mm (13 in)
10,000 Unit
4/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT04
PACKAGE DIMENSIONS
SC70−5/SC−88A/SOT−353
DF SUFFIX
G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
A
5
4
S
1
2
3
−B−
D
5 PL
0.2 (0.008)
M
B
M
N
J
C
DIM
A
B
C
D
G
H
J
K
N
S
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm
inches
5/6
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