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BCW30LT1

Description
General Purpose Transistors
CategoryDiscrete semiconductor    The transistor   
File Size272KB,8 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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General Purpose Transistors

BCW30LT1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Reach Compliance Codeunknow
Maximum collector current (IC)0.1 A
Collector-based maximum capacity7 pF
Collector-emitter maximum voltage32 V
ConfigurationSINGLE
Minimum DC current gain (hFE)215
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typePNP
Maximum power consumption environment0.225 W
Maximum power dissipation(Abs)0.225 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
Transistor component materialsSILICON
VCEsat-Max0.3 V
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by BCW29LT1/D
General Purpose Transistors
PNP Silicon
COLLECTOR
3
1
BASE
2
EMITTER
BCW29LT1
BCW30LT1
3
1
MAXIMUM RATINGS
Rating
Collector–Emitter Voltage
Collector–Base Voltage
Emitter–Base Voltage
Collector Current – Continuous
Symbol
VCEO
VCBO
VEBO
IC
Value
–32
–32
–5.0
–100
Unit
Vdc
Vdc
Vdc
mAdc
2
CASE 318 – 08, STYLE 6
SOT– 23 (TO – 236AB)
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
Symbol
PD
Max
225
1.8
R
θJA
PD
556
300
2.4
R
θJA
TJ, Tstg
417
– 55 to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
DEVICE MARKING
BCW29LT1 = C1; BCW30LT1 = C2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage
(IC = –2.0 mAdc, IE = 0)
Collector–Emitter Breakdown Voltage
(IC = –100
µAdc,
VEB = 0)
Collector–Base Breakdown Voltage
(IC = –10
µAdc,
IC = 0)
Emitter–Base Breakdown Voltage
(IE = –10
µAdc,
IC = 0)
Collector Cutoff Current
(VCB = –32 Vdc, IE = 0)
(VCB = –32 Vdc, IE = 0, TA = 100°C)
1. FR– 5 = 1.0
0.75
2. Alumina = 0.4 0.3
V(BR)CEO
V(BR)CES
V(BR)CBO
V(BR)EBO
ICBO
–100
–10
nAdc
µAdc
–32
–32
–32
–5.0
Vdc
Vdc
Vdc
Vdc


0.062 in.
 
0.024 in. 99.5% alumina.
Thermal Clad is a trademark of the Bergquist Company
Motorola Small–Signal Transistors, FETs and Diodes Device Data
©
Motorola, Inc. 1996
1

BCW30LT1 Related Products

BCW30LT1 BCW29LT1
Description General Purpose Transistors General Purpose Transistors
Is it Rohs certified? incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP )
Reach Compliance Code unknow unknow
Maximum collector current (IC) 0.1 A 0.1 A
Collector-based maximum capacity 7 pF 7 pF
Collector-emitter maximum voltage 32 V 32 V
Configuration SINGLE SINGLE
Minimum DC current gain (hFE) 215 120
JEDEC-95 code TO-236AB TO-236AB
JESD-30 code R-PDSO-G3 R-PDSO-G3
JESD-609 code e0 e0
Number of components 1 1
Number of terminals 3 3
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Polarity/channel type PNP PNP
Maximum power consumption environment 0.225 W 0.225 W
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Transistor component materials SILICON SILICON
VCEsat-Max 0.3 V 0.3 V

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