2.5 mm x 3.2 mm Ceramic Package SMD TCXO
I537/I538/I737/I738 Series
3.20
4
3
Product Features:
Low Jitter, Non-PLL Based Output
Available in Both Clipped Sinewave and
HCMOS Output Levels
Compatible with Leadfree Processing
Applications:
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
Fibre Channel
2.50
1
2
Frequency
Output Level
Clipped Sinewave
HCMOS
Output Load
Clipped Sinewave
HCMOS
Duty Cycle (HCMOS)
Rise / Fall Time
(HCMOS)
Frequency Stability
Vs Temperature
Vs Voltage
Vs Load(5%)
Frequency Tolerance @ 25
C
Aging
Supply Voltage
Current
8.000 Mhz to 40 Mhz
0.8 V p-p Min.
‘0’=0.5 VDC Max., ‘1’=0.8Vcc Min.
20K Ohms / 10 pF
15pF
50% ±10%
1.2 Max.
0.10
1
2
4
3
0.84
0.60
10 nS Max.
0.10
See Frequency Stability Table
0.3 ppm Max.
.0.2
ppm Max.
1.0 ppm
1 ppm / Year Max.
See Supply Voltage Table , tolerance
5%
2.0 mA Max. (Clipped Sinewave)
6.0 mA Max. (HCMOS)
4
3
Recommended Pad Layout
2.40
2.0
1
2
1.3
0.9
Voltage Control
(I737/I738)
Operating
Storage
Phase Noise
(Typ. @ 20 Mhz)
1.5 VDC
1.0 VDC,
5.0 ppm Min.
See Operating Temperature Table
-40
C to +85
C
-86 dBc/Hz @ 10 Hz
-115 dBc/Hz @ 100 Hz
-138 dBc/Hz @ 1KHz
-146 dBc/Hz @ 10 Khz
Pin
1
2
3
4
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
I537 (Clipped Sinewave TCXO)
I538 (HCMOS TCXO)
I737 (Clipped Sinewave TCVCXO)
I738 (HCMOS TCVCXO)
Part Number Guide
Operating Temperature
7 = 0 C to +50 C
1 = 0 C to +70 C
3 = -20 C to +70 C
2 = -40 C to +85 C
Sample Part Number: I537-1Q3-20.000 Mhz
FrequencyStability vs Temperature
Supply Voltage
**N =
1.0
ppm
**O =
1.5
ppm
**P =
2.0
ppm
Q =
2.5
ppm
R =
3.0
ppm
J =
5.0
ppm
3 = 3.3 V
7 = 3.0 V
2 = 2.7 V
Frequency
- 20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/11 _D
Specifications subject to change without notice
Page 1
2.5 mm x 3.2 mm Ceramic Package SMD TCXO
Pb Free Solder Reflow Profile:
I537/I538/I737/I738 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I - Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/11 _D
Specifications subject to change without notice
Page 2
FPGA/CPLD
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