2.0 mm x 2.5 mm Ceramic Package SMD TCXO
I587 Series
Product Features:
Low Current Consumption
Ultra Miniature Package
RoHS Compliant
Compatible with Leadfree Processing
Applications:
GPS, GPS Module
CDMA/WCDMA
802.11 / Wifi
T1/E1, T3/E3
2.0+/-0.2
2.50+/- 0.2
4
3
1
2
Frequency
Output Level
Clipped Sinewave
Output Load
Clipped Sinewave
Frequency Stability
Vs Temperature
Vs Voltage
Vs Load(5%)
Frequency Tolerance @ 25
C
Aging
Supply Voltage
Current
Operating
Storage
Harmonics
Phase Noise
(Contact Sales Channel for available frequencies)
1.1 Max.
0.8 V p-p Min.
0.10
0.6
2
10K Ohms / 10 pF
1
4
3
0.5 ppm Max
0.2 ppm Max.
.0.2
ppm Max.
2
.0 ppm (After 2 Reflow)
1 ppm / Year Max.
See Supply Voltage Table , tolerance
5%
nd
0.10
0.5
Recommended Pad Layout
2.80
4
3
0.6
2.3
2.0 mA Max.
See Operating Temperature Table
-40
C to +85
C
-8.0 dBc Max.
-130 dBc/Hz @ 1KHz
1
2
1.4
No pattern area
Pin
1
2
3
4
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
I587 (Clipped Sinewave TCXO)
Part Number Guide
Operating Temperature
5 = -30 C to +85 C
Sample Part Number: I587-5Y8-26.000 Mhz
FrequencyStability vs Temperature
Supply Voltage
Y =
0.5
ppm
3 = 3.3 V
7 = 3.0 V
8 = 2.8 V
2 = 2.7 V
1 = 1.8 V
Frequency
- 26.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
11/07/12_F
Specifications subject to change without notice
Page 1
2.0 mm x 2.5 mm Ceramic Package SMD TCXO
Pb Free Solder Reflow Profile:
Typical Application:
I587 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: XXXXXX(Internal Crystal Code)
Line 2:
●
(Pin 1 Designator)XXX(internal codes)YMD(Year Month Day)
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
11/07/12_F
Specifications subject to change without notice
Page 2
Embedded System
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