5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS
I605 Series
Product Features:
Small Surface Mount Package
Based Output for many frequencies
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
Applications:
SD/HD Video
Wireless Base Stations
Sonet /SDH
VoIP
T1/E1, T3/E3
5.0
0.2
7.0 0.3
Frequency
Output Level
HC-MOS
TTL
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
Start-up Time
Supply Voltage
Control Voltage
Pull Range
Current
Linearity
Temperature
Operating
Storage
1 MHz to 170.000 MHz
2.0 Max.
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
50% ±5%
10.0 nS Max.
15pF, Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 TTL
50 ppm Max.
10 mS Max.
See Input Voltage Table, tolerance ±5 %
1.65 VDC ±1.5 VDC for 3.3 VDC, 2.5 VDC ±2.0 VDC for 5.0 VDC
See Pullability Table
50 mA Max**
10% Max.
Bypass =0.01 uF
Recommended Pad Layout
5.08
5.08
4.2
2.0
See Operating Temperature Table in Part Number Guide
-55
C to +125
C
Phase Jitter
<3 pS RMS
Pin
1
2
3
4
5
6
Connection
Control Voltage
Enable / Disable
Ground
Output
N.C.
Vdd
Dimension Units: mm
Part Number Guide
Package
Operating
Temperature
1 = 0 C to +70 C
6 = -10 C to +70 C
Sample Part Number: I605-1BC3H-20.000
Stability
Pullability
(in ppm)
*D =
15
A =
25
B =
50
C =
100
B =
50
PPM Min.
C =
100
PPM Min.
Supply
Voltage
5 = 5.0 VDC
3 = 3.3 VDC
Enable /
Disable
H = Enable
Frequency
- 20.000 MHz
I605 -
3 = -20 C to +70 C
4 = -30 C to +75 C
2 = -40 C to +85 C
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
* Not available at all frequencies. ** Frequency, supply, and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/10_C
Specifications subject to change without notice
P
age 1
5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS
Pb Free Solder Reflow Profile:
Typical Application:
I605 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/10_C
Specifications subject to change without notice
P
age 2
Embedded System
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