10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
I606 Series
Product Features:
Small Surface Mount Package
Low Noise
Pb Free/ RoHS Complient
Compatible with Leadfree Processing
Applications:
SD/HD Video
Wireless Base Stations
Sonet /SDH
Server and Storage
14.3 Max.
10.2 Max.
Frequency
Output Level
LVDS
LVPECL
Duty Cycle
Rise / Fall Time
Output Load
LVDS
LVPECL
Frequency Stability
Start-up Time
Supply Voltage
Current
Linearity
Pullability
Control Voltage
Input Impedance
Jitter
Operating
Storage
1 MHz to 180.000 MHz
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
50% ±10%
0.6 nS Max.
100
Ω
Differential
50
Ω
to Vcc - 2.0 VDC
50 ppm Max.
10 mS Max.
3.3 VDC ± 5%
LVDS = 90 mA Max., LVPECL = 130 mA Max.
15% Max.
See Table Below
1.65 VDC ± 1.5 VDC
50K
Ω
Min.
<1.0 pS RMS (12 kHz to 20 MHz)*
See Operating Temperature Table in Part Number Guide
-55
°
C to +125
°
C
6.0 Max.
0.5
Typ.
2.54
Recommended pad layout
0.8
8.8
3.0
Pin Connection
1 Voltage Control
2 Enable/Disable
3 GND
4 Output
5 Comp. Outout
6 Vcc
Dimension Units: mm
Part Number Guide
Package
Operating
Temperature
1 = 0° C to +70° C
3 = -20° C to +70° C
2 = -40° C to +85° C
Sample Part Number:
Stability
(in ppm)
**D =
±15
A =
±25
B =
±50
C =
±100
I606–1BC8H–155.520
Output
8 = LVDS
9 = LVPECL
-155.520 MHz
Pullability
B =
±50
ppm
C =
±100
ppm
Enable /
Disable
H = Enable
Frequency
I606
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
*Frequency related, for additional information contact your sales representative. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 1
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
Pb Free Solder Reflow Profile:
Typical Application:
I606 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: XXXXX (I606-XXXXX- Freq)
Line 3: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 2
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
